Grand Opening Keynote

Date: Wednesday, March 20, 2019
Time: 12:30 – 16:40
Venue: Grand Shanghai Ballroom 1, 3F, Kerry Hotel Pudong, Shanghai
Chinese and English Simultaneous Interpretation will be provided

Attendee Registration   Previous review

The "Grand Opening Keynote" marks the start of SEMICON and FPD China. High-profile industry leaders will give keynote speeches, sharing insights on the global industry landscape, technology trend, and market. It is a golden opportunity to exchange ideas with the top global semiconductor industry leaders.


Agenda 会议日程:

12:30 – 13:00 Registration 来宾登记
13:00 – 13:30
Opening Remark 开幕致辞
Lung Chu
President, SEMI China; Vice President, SEMI
Ajit Manocha
President & CEO, SEMI
Ajit Manocha, SEMI总裁兼首席执行官
Wang Ning
President, CECC
  Government Official Speech
Moderator Introduces Speakers 主持人介绍主题演讲嘉宾
Cho Tomoyasu
VP, China President, KLA Corporation
张智安,KLA Corporation中国区总裁
  Keynote Speech 主题演讲
13:40 – 14:05
Openness Innovation Collaboration
Zhang Suxin
Chairman, Shanghai Huahong (Group) Co., Ltd
14:05 – 14:30
Accelerating Innovation, Driving the Data Era
Timothy M. Archer
President and Chief Executive Officer, Lam Research
Timothy M. Archer,泛林集团总裁兼首席执行官
14:30 – 14:55
AI: The Semiconductor Opportunity
Lip-Bu Tan
CEO, Cadence Design Systems, Inc.
14:55 – 15:20
Addressing Technology Challenges in the Era of Cognitive Computing & Non-Linear Dynamics
Akihisa Sekiguchi
CTO, Tokyo Electron Limited
15:20 – 15:45
Paradigm Inflection of Packaging Industry
Choon Heung Lee
Chief Executive Officer, Jiangsu Changjiang Electronics Technology Co., Ltd
15:45 – 16:10
AIoT 2030: How AI and IoT are changing products, processes and platforms
Sarah Cooper
GM, AWS Outcome Driven Engineering, Amazon
16:10 – 16:35
Closing Keynote
Growing Faster Together - Realizing the Potential of the A.I.-Big Data Era
Gary Dickerson
President and Chief Executive Officer, Applied Materials, Inc.
16:35 – 16:40 Thank you 致谢结束
*Agenda is subject to change 议程变化恕不另行通知