(** to designate keynote talk, * to designate invite talk)
Sunday, March 11, 2018 Shanghai International Convention Center
Meeting Room：3rd Floor Yellow River Hall 黄河厅
Joint Session: Symposium II and Symposium III-Lithography/Etch joint session
Session Chairs: Kafai Lai / Ying Zhang
| 13:30-13:35 | Opening Remarks |
| Kafai Lai / Ying Zhang | |
| **13:35-14:05 | Patterning Roadmap |
| Rich Wise, Lam Research | |
| **14:05-14:35 | Patterning challenges and opportunities for Advanced Memory Technology |
| Gill Lee, AMAT | |
| *14:35-14:55 | Desirable material selection on Self-aligned Multi-patterning |
| Hidetami Yaegashi, TEL | |
| 14:55-15:10 | Coffee Break |
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Session II: Computational Lithography
Session Chairs: Yayi Wei / Shiyuan Liu
| **15:10-15:40 | Machine Learning for Computational Lithography | ||
| Yu Cao, ASML-Brion | |||
| *15:40-16:00 | Lithography simulations for flat panel display manufacturing | ||
| Thomas Muelder, Synopsys | |||
| *16:00-16:20 | Full-chip GPU-Accelerated Curvilinear Dose and Shape Correction for EUV Photomasks | ||
| Ryan Pearman,D2S | |||
| *16:20-16:40 | Resist Model Setup for Negative Tone Development at 14nm Node | ||
| Lijun Zhao, Institute of Microelectronics of Chinese Academy of Sciences | |||
| 16:40-16:55 | Source and Mask Co-Optimization Based on Depth Learning Methods | ||
| Yijiang Shen, Guangdong University of Technology | |||
| 16:55-17:10 | An Optical Proximity Model for Negative Toned Developing Photoresists | ||
| Qiang Wu, SMIC | |||
| 17:10-17:25 | Lens Thermal Behavior Based Exposure Process Control for Flat Panel Display Lithographic Tools | ||
| Zhiyong Yang, Huazhong University of Science and Technology | |||
| Poster Session: | Location: 5th Floor | ||
| Coffee Break | Study of Unique Pseudo Buried Layer in 0.18um SiGe BiCMOS Process | ||
| Donghua Liu, HHGrace | |||
| Lithography Process Optimization for Emitter Window in SiGe-HBT Device | |||
| Ziquan Fang, HHGrace | |||
| A Fast Directed Self-Assembly Model Based on Support Vector Machine for Grapho-Epitaxy Hole Process | |||
| Peng Gong, Huazhong University of Science and Technology | |||
| Study on Planarization Performance of Spin on Hardmask | |||
| Huichan Yun, Samsung SDI | |||
| The Application of Dosemapper in SOI Dummy Gate Process | |||
| KE CHEN, SMIC | |||
| Multi-armed Block Copolymer for sub-10 nm Directed Self-assembly | |||
| Jianuo Zhou, Fudan University | |||
| A Novel Lithographic Material Constructed by Polymerizable Liquid Crystal Molecule | |||
| Hai Deng, Fudan university | |||
| A Study of Photoresist Residue Defect induced by Substrate Surface condition | |||
| Zhou Fang, SMIC | |||
| Investigation of the process window capability in 14nm Via lithography with the Negative Tone Developing Process | |||
| Haihua Chen, SMIC | |||
| Challenges and Solutions of few-line patterns with freeform illumination in immersion lithography | |||
| Peipei Liang, SMIC | |||
| The framecell design co-optimization with process in advanced technology nodes | |||
| Qiao qiao Li, SMIC | |||
| Research of Lithograph Process of Polymide Photo Resist for Passivation Thick Films | |||
| Zhao Wang, R&D Center, CRRC Yongji Electric Co., Ltd. | |||
| A Rigorous-Coupled-Wave-Analysis for Micro-Diffraction-Based-Focus Function in Advanced Node | |||
| Xuan Liu, SMIC | |||
| Study of Lithography System Resolution Based on Partially Coherent Theory | |||
| Qin WANG, SMIC | |||
| The Study on the Diffraction Spectrum of Adding SBAR during the Source Mask Optimization (SMO) Process | |||
| Miao XIA, SMIC | |||
| Illumination Source Optimization coupled with NTD Process in Metal Layout | |||
| Zhifeng Gan, SMIC | |||
| Overlay measurement calibration for deformation wafers through multiple types of marks | |||
| Tao Song, SMIC | |||
| Nanometer Scale Mixed Pattern Formed by Self-aligned Spacer Image Transfer and Optical Lithography Technology | |||
| Zhaohao Zhang, IME | |||
| Next Generation DUV Light Source Technologies for 7nm and below | |||
| Simon Hsieh, Cymer-ASML | |||
Monday, March 12, 2018 Shanghai International Convention Center
Meeting Room: 3rd Floor Yellow River Hall黄河厅
Joint Session: Symposium II and Symposium IX-DTCO joint session
Session Chairs: Yiyu Shi / Leo Pang
| 8:30-8:35 | Opening Remarks |
| Yiyu Shi / Leo Pang | |
| **8:35-9:05 | Close – loop – design and manufacturing optimization for advanced nodes |
| Steffen Schulze, Mentor Graphics | |
| **9:05-9:35 | Machine Learning for Lithography and Physical Design |
| David Pan, University of Texas at Austin | |
| **9:35-10:05 | Novel Approaches to Circuit Timing |
| Ulf Schlicthmann, Technical University of Munich | |
| 10:05-10:20 | Coffee Break |
Session IV: Tool, Mask & Metrology
Session Chairs: Motokatsu Imai / Qiang Wu
| **10:20-10:50 | High Power LPP-EUV Source with Long Collector Mirror Lifetime for High Volume Semiconductor Manufacturing |
| Hakaru Mizoguchi, Gigaphoton Inc. | |
| *10:50-11:10 | Multi-beam mask writer MBM-1000 |
| Hiroshi Matsumoto, NuFlare | |
| *11:10-11:30 | Display photomask requirements have reached a new level and matches low end semicon |
| Robert Eklund, Mycronic | |
| *11:30-11:50 | Robust overlay metrology by Mueller matrix ellipsometry with a differential calculus |
| Xiuguo Chen, HUST | |
| *11:50-12:10 | Advanced CD-SEM metrology for Process control of 14 nm-node HVM and beyond |
| Takeshi Kato, Hitachi High Technologies | |
| 12:10-13:40 | Lunch Break |
Session V: Multiple patterning
Session Chairs: Wanh Yueh / Zhimin Zhu
| *13:40-14:00 | Accessing light source driven contrast variation impact on hotspots using Lithography Manufacturability Checker (LMC) |
| Will Conley, ASML-Cymer | |
| *14:00-14:20 | Sketch and Peel Lithography for Multiscale Patterning |
| Huigao Duan, Hunan University | |
| *14:20-14:40 | Inter-mask effects in EUV lithography |
| Christopher Progler, Photronics Inc. | |
| 14:40-14:55 | Study on Spin-on Hardmask for Quad-layer Application |
| Yushin Park, Samsung SDI | |
| 14:55-15:10 | Comparative Analysis of Resist Model Stability in Negative Tone Development Process |
| Hua Cai, SMIC | |
| 15:10-15:25 | Gate patterning strategies of vertically stacked gate-all-around silicon nanowire MOSFET devices |
| Lingkuan Meng, Institute of Microelectronics, Chinese Academy of Sciences | |
| 15:25-15:40 | Coffee Break |
Session VI: Process & Material
Session Chairs: Gyomei Shiba / Hai Deng
| *15:40-16:00 | Advanced Topcoat and Embedded Barrier Layer (EBL) for 193nm Immersion Lithography |
| Cong Liu (Colin), Dow Chemical | |
| *16:00-16:20 | Advanced Lithography Material Status toward 7nm Node and beyond |
| Kouichi Fujiwara, JSR | |
| *16:20-16:40 | High fedelity lithography against stochastic effects |
| Zhimin Zhu, Brewers science | |
| *16:40-17:00 | Advanced Photoresist and Material development in China |
| Yusong Sun, Hantop | |
| 17:00-17:15 | A Study of Multi-Factor Surface Influence on Resist LWR Performance |
| Dongxu Yang, SMIC | |
| 17:15-17:30 | Ultra-Fast Directly Self-Assembly Materials for Sub-5 nm Lithographic Patterning |
| Xue Miao Li, Fudan University |