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David Duffin Vice President of Product Engineering and Testing Engineering, Yangtze Memory Technology Company |
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Biography David Duffin is Vice President of Product, Test and Assembly Engineering at YMTC, a position he has held since joining the company in April 2016. Duffin’s career has included positions at Hughes Aircraft Company, Advanced Micro Devices, Spansion and most recently SanDisk where he was Vice President for Product and Test Engineering for the whole SanDisk portfolio of products. Duffin has worked in the UK, the US and has managed teams in China, India, Israel, Japan, Malaysia and Thailand, he now is based in Wuhan, China. Duffin has worked on many generations of memory technologies from 1980’s generation EEPROM through to 3D-NAND. In that time he has delivered products across the full spectrum of market segments from retail, mobile, embedded, client, enterprise, automotive and military. Duffin received his Bachelor of Engineering with Honors in Electronic Engineering from Abertay University in Dundee, UK. |
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