Date: | Wednesday, March 20, 2013 | |
Time: | 08:30 – 16:50 | |
Venue: | Ballroom 2&3,Kerry Hotel Pudong, Shanghai | |
Note: | Chinese and English Simultaneous Interpretation will be provided on-site. | |
Sponsored by:
Program Brief
Nowadays, electronic products are becoming shorter, smaller, thinner, and lighter. To meet these requirements, we need to scale down the wafer size according to Moore’s Law. However, as the scale of the chip size shrinks, Moore’s Law has reached its limit. What shall we do beyond Moore’s Law? SEMI China will hold a forum to discuss the solution of 3D Integration and analyze the market trend of this technology.
Topics:
Market Analysis of 3DIC
10:40-11:10
Electrical,Thermal and Mechanical Characterizations
Challenges faced by wet process in 3D TSV application
13:30-14:00
ATE solutions to 3DIC test challenges: The Readiness of Advantest’s V93000
Approaches Overview of 3DIC Integration
New Materials in 3DIC Integration
Testing of 3DIC Integration
Modeling of 3DIC Integration
Roadmap Discussion of 3DIC in China
Challenges of 3D IC Development in China
EDA Tools Support for 3DIC
Panel Discussion
Who Should Attend
Executives, Experts, engineers, researchers, scholars related to auto-motive electronics design, manufacturing and service
Agenda
Conference Host: TBD
8:30-9:00
Registration
9:00-9:10
Opening Remark
Denny McGuick
President & CEO, SEMI
9:10-9:40
3D Integration: where is that killer app?
Subramanian S. Iyer
IBM Fellow and Chief Technologist at the Microelectronics Division, IBM Systems & Technology Group
9:40-10:10
Electrical,Thermal and Mechanical Characterizations
Nozad Karim
Vice President, Amkor
[email protected]
10:10-10:40
Test Strategies for memory interfaces in 3D-IC
Gregory Smith
General Manager, Teradyne Computing & Communications Business Unit
[email protected]
Shiuh-Wuu Lee
Sr. VP, Technology Research & Development, SMIC
slides download
11:10-11:40
3D-SiP at Center Stage of Post-PC era
Walter Jau
Director, Corporate R&D, ASE Group
http://www.aseglobal.com/en/
13:00-13:30
ACM David H. Wang
CEO, ACM
[email protected]
Kelvin Xia
Senior director, Phd Business Strategy Development Department, Advantest
[email protected]
14:00-14:20
Tea Break
14:20-14:50
Sputtering Application in Advanced Packaging
Dr. Ding Peijun
VP Beijing NMC Co., Ltd.
[email protected]
14:50-15:20
3D Interconnect Plating Developments -Opportunities and Challenges
Dr. Zhen Qiu Liu
Director of Wet Process Engineering, TEL NEXX, Inc. USA
[email protected]
15:20-15:50
TSV Technology and its Application
Dr. Daniel SHI
R&D Director, ASTRI (Hong Kong Applied Science & Technology Research Institute)
15:50-16:20
US Patent Topology in 3DIC Technologies and Licensing Considerations
Sherry Wu
Attorney-at-Law, Finnegan, Henderson, Farabow, Garrett & Dunner, LLP
slides download
16:20-16:50
3DIC & 2.5D Interposer market trends and technological evolutions
Pascal Viaud
CTO, Yole Développement, Taiwan Office
slides download
Contact us:
Program Manager:
Mr. Kevin Wu
Tel:86.21.6027.8558
Email:[email protected]
Mr.Norman Cheng
Tel:86.21.6027.8557
Email:[email protected]
Customer Service:
Mr. Norman Cheng
Tel:86.21.6027.8557
Email:[email protected]