Symposium IX: Emerging Semiconductor Technologies

Confirmed Invited Speakers


Symposium Committee

Dr. Chung Lam
Chair

IBM T. J. Watson Research Center, USA

Dr. Hyungjun KIM
Co-chair

Yonsei University, South Korea

Dr. Paul R. BERGER
Co-chiar

Ohio State University, USA

Dr. Edward Y. CHANG
Member

National Chiao Tung University, China

Dr. Jinn P. CHU
Member

National Taiwan University of Science and Technology, China
Dr. Daniele Lelmini
Member		 Politecnico Di Milano, Milano, Italy

Dr. Jing KONG
Member

MIT, USA
Dr. Hsiang-Lan Lung
Member		 Macronix International Ltd., Hsinchu, China

Dr. Fuhua YANG
Member

Institute of Semiconductor, Chinese Academy of Sciences, China

Dr. Wang YUEH
Member

Intel, USA

Dr. Jie ZHANG
Member

IMRE, Singapore
Kangguo Cheng
Member		 IBM, USA

Symposium IX: Emerging Semiconductor Technologies

  •  Extension of Si CMOS technology
    -          FinFETs
    -          Si nanowire-based FETs
    -          Ultra-thin SOI technology
    -          III-V Semiconductors

  • 3D integration
    -          Through silicon via technology
    -          3D integration of heterogeneous devices and functions
    -          Simulation and modeling of 3D integration
    -          Other novel concepts of multi-dimensional integration of devices and functions

  • Post-CMOS device options
    -          Growth , assembly and device /system demonstration of carbon nanotubes and graphene
    -          Spintronics,
    -          Molecular electronics,
    -          Single electron transistors,
    -          Quantum dots
    -          Simulation and modeling of post-CMOS devices
    -          Other novel device concepts and demonstration

  • Photonics, future interconnects, optoelectronic devices
    -          Si photonics, nanophotonics, optical interconnects,
    -          Carbon nanotube- based interconnects, nanowire nanowire-based interconnects
    -          Novel interconnect concepts, such as photo-patternable low-k and nanoimprint of interconnect structures
    -          Optoelectronic al materials and devices

  • Novel memory technologies
    -          Magnetic memory (MRAM),
    -          Phase change memory
    -          Resistive memory
    -          Ferroelectric memory
    -          Organic and polymer memory
    -          Recent advances in DRAM, NAND memory technologies

  • Organic and plastic semiconductors, flexible electronics
    -          Synthesis and device demonstration of novel organic semiconducting materials
    -          Organic electronics for RFID, LED, memory, display, photovoltaic
    -          Low-cost processing of organic electronics, such as solution processing and roll-to-roll processing

  • Emerging lithography and non-traditional pattern techniques
    -          EUV lithography: optics, light sources, masks, resists, patterning and integration demonstration
    -          Nanoimprint lithography: Concept, mask making, materials, patterning and integration demonstration
    -          Self-assembly and directed-assembly patterning: material synthesis, patterning, defect-reduction and device demonstration
    -          Other non-traditional patterning techniques

  • Other applications of semiconductor devices and processes
    -          Energy generation, conversation and storage devices and systems, such as solar cells, battery technology, supercapacitors
    -          Sensors
    -          MEMS, Bio-MEMS
    -          LEDs
    -          Micro-fluidics and biomedical devices 
    -          Bio-chips

  • Environmentally-friendly and energy-efficient semiconductor manufacturing