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Lang Chen
Associate Research Fellow
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Lang Chen has been conducting research in advanced packaging under the supervision of Professor Wei Wang since 2019 and currently focuses on three-dimensional microsystem integration. His main research interests include flexible 3D multimodal chiplet integration, wafer-level 3D integration using submicrometer through-silicon vias, and intelligent micro/nanofabrication based on physics-informed neural networks. He has published more than 20 papers, filed over 30 patent applications, led several national research projects, and collaborated with organizations including NAURA, Huawei, CASC Institute 771, and Huatian Technology. |
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