Green High-Tech Facility International Forum


Date: Friday, March 22, 2024
Time: 09:30-12:35
Venue: Grand Shanghai Ballroom 3, Kerry Hotel Pudong, Shanghai
Simultaneous Interpretation will be provided.

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With the rapid development of emerging technologies such as 5G, artificial intelligence, Internet of Things, and autonomous driving, the demand for semiconductors continues to grow, semiconductor companies have increased investment in advanced processes and expanded production scale. According to the 《2026 200mm Fab Outlook Report》released by SEMI, global semiconductor manufacturers are expected to increase 200mm fab capacity by 14% from 2023 to 2026, adding 12 new 200mm fabs (excluding EPI), reaching a record high of more than 7.7 million wafers per month. The huge amount of chemicals are used in semiconductor production, energy consumption, emission generation and other problems have brought serious impact on the environment. In order to cope with these challenges, semiconductor companies have begun to actively carry out technological innovation, increase investment in research and development , in order to gradually build sustainable chip factories.

This forum aims to provide a platform for global semiconductor enterprises to share the low-carbon trend solutions of future chip factories、the key to energy efficiency management、the construction of key links of the industrial chain、professional personnel training platform, jointly promote green transformation, and exchange on the future semiconductor green plant development of strategic planning.

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Agenda / 议程
   
09:00-09:30
Registration 会议登记注册
Moderator / 主持人:

韩本杰
华为数字能源技术有限公司,中国区数字能源精密制造关键供电拓展部部长
   
09:30-09:35
Opening Remarks/开幕致辞
Lung Chu, President, SEMI China; Vice President, SEMI
居龙,SEMI全球副总裁、中国区总裁
   
09:35-09:40
Welcome Remarks/欢迎致辞
Ron R.T.Horng 洪荣聪
Vice President/Chief Environment Office,Foxconn Technology Group
富士康(鸿海)科技集团,环保长/副总经理
   
09:40-10:05 京东方科技集团股份有限公司
   
10:05-10:30
数字化洁净技术如何赋能半导体产业价值链探索
夏群艳
深圳市亿天净化技术有限公司,总经理
   
10:30-10:55
绿色厂务设计与实践
James Shi 史继承
Director, Runpeng Semiconductor(Shenzhen)Co.,Ltd.
润鹏半导体(深圳)有限公司,总监
   
10:55-11:20
数字化赋能先进半导体工厂规划设计
程星华
中国电子工程设计院股份有限公司,数字化技术中心常务副总监
   
11:20-11:45
半导体厂务的“1-4-4-2-1”
Linlin Cao 曹琳琳
施耐德电气(中国)有限公司,施耐德电气数字能效首席架构师,全球爱迪生专家
   
11:45-12:10
绿色低碳发展趋势下水处理相关的新思路
Jun Liu 刘俊
KURITA WATER INDUSTRIES(SUZHOU)CO.,LTD
栗田工业(苏州)水处理有限公司,CSV推进部部长
   
12:10-12:35
Closing Keynote/闭幕演讲
Ron R.T.Horng 洪荣聪
Vice President/Chief Environment Office,Foxconn Technology Group
富士康(鸿海)科技集团,环保长/副总经理
   
* 议程以最终版为准
* Please refer to the final version of Agenda.