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Education:
• Master of industrial & mechanical engineering department, Univ. of Wisconsin, Madison
Job Experience:
• Over 20 year of job experience on semiconductor industry, especially focus on bumping and flip chip advanced assembly technology.
• Vice Chairman of Semiconductor Equipment and Matenals international Taiwan Association.
• Chairman of TILA(Taiwan intelligent Leader Association)
Now:
• Senior Director of Engineering Center of SPIL (Swconware,Taiwan, China),which is 3 rd biggest assembly house in the world now
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