Symposium IX: Emerging Semiconductor Technologies (** to designate keynote talk, * to designate invite talk) Sunday, March 13, 2016 Shanghai International Convention Center Session I: Advanced Logic Technologies Session Chair: Dr. SangBum Kim *13:30-13:55 Advanced CMOS Technology Development at GLOBALFOUNDRIES Dr. Chung-Hsun Lin, GLOBALFOUNDRIES *13:55-14:20 Study On The Electrical Characteristics of In Situ PEALD-Passivated HfO2/In0.53Ga0.47As MOSCAP and MOSFET Structures Prof. Edward Yi Chang, National Chiao Tung University *14:20-14:45 Forming New Silicide Heterostructures in Semiconductor Nanowires Prof. Yi-Chia Chou, NCTU *14:45-15:10 Steep Slope Devices with InGaAs Channel for Post Si CMOS Application Prof. Yasuyuki Miyamoto, Tokyo Institute of Technology 15:10-15:25 Coffee Break Session II: Emerging Semiconductor Technologies *15:25-15:50 Solution for Nanoelectronics Beyond the 7nm Node Dr. Carlo Reita, CEA LETI *15:50-16:15 Neuromorphic Computing Based on Emerging Non-volatile Memory Devices Dr. SangBum Kim, IBM T.J. Watson Research Center *16:15-16:40 Ultrastable-Stealth Large Gold Nanoparticles with DNA Directed Biological Functionality Dr. Jung Heon Lee , Sungkyunkwan University (SKKU) *16:40-16:55 Application of Annealing System for Sub 28nm Node Dr. Hougong Wang, NMC 16:55-17:10 Pulse Gas Delivery Mass Flow Controllers for TSV Applications Dr. Junhua Ding, MKS Instruments, Inc. 17:10-17:25 The Effect of N2O Plasma Treatment on Indium Oxide Thin Film Transistor by Low Temperature Atomic Layer Deposition Jiazhen Sheng, Hanyang University Monday, March 14, 2016 Shanghai International Convention Center Session III: Emerging Semiconductor Memory Technologies Session Chair: Dr. Hsiang-Lan Lung *8:45-9:10 Resistive RAM: Beyond Emerging Memory Technology Dr. Sung Hyun Jo, Crossbar *9:10-9:35 High Density PCM Technology Prof. Hongsik Jeong, Yonsei University *9:35-10:00 Projecting the Reliability for 40 nm Embedded ReRAM and Beyond Dr. Zhiqiang Wei, Panasonic Semiconductor Solutions Co., Ltd., *10:00-10:25 Counterproductive Switching (CS) in Oxide-Based Filamentary Resistive Memories Dr. Frederick Chen , Winbond 10:25-10:40 Coffee Break Session IV: Advanced Optic Semiconductor Technologies Session Chair: Prof. Kuan-Neng Chen *10:40-11:05 Optoelectronics based on Two-dimensional Semiconductor Heterostructures Prof. Chul-Ho Lee, Korea University 11:05-11:20 Optics vs. Copper – From the Perspective of Thunderbolt Interconnect Technology Dr. Hengju Cheng, Intel *11:20-11:45 Optical receiver with Si photonics for high speed optical communication Dr. Wenqi Zhang, National Center for Advanced Packaging (NCAP) 11:45-12:00 Investigation of Localized Surface Plasmon Enhancement on Organic Light Emitting Diode by Numerical Analysis in 3D model Jyue-Ru Chen, National Central University 12:00-13:30 Lunch Break Session V: 3D & Power Semiconductor Technologies Session chair: Dr. Hsiang-Lan Lung *13:30-13:55 Research Advances of Low Temperature Bonding Technology in 3D Integration and Heterogeneous Integration Prof. Kuan-Neng Chen, National Chiao Tung University *13:55-14:20 Submicron Polymer Temporary Bonding with Ultra-Fast Laser Ablation Application in 3D Semiconductor Package Dr. Chien-Hung Lin, Kingyoup Optronics Prof. Kuan-Neng Chen, National Chiao Tung University *14:20-14:45 Application of ALD to Energy Devices Prof. Jihwan An, Seoul National University of Science and Technology *14:45-15:10 GaN-based Heterojunction FETs for Power Applications Prof. Masaaki Kuzuhara, University of Fukui 15:10-15:25 Coffee Break Session VI: 2D Semiconductor and Quantum Dot Session chair: Prof. Jusang Park 15:25-15:40 Yen-Teng Ho, National Chiao Tung University 15:40-16:05 Yuxi Zhao, Yonsei University 16:05-16:20 Youngjun Kim, Yonsei University 16:20-16:35 Jeong-Gyu Song, Yonsei University 16:35-16:50 Cheng-Pin Chang, National Central University
Meeting Room：3G
Session Chair: Dr. Chung-Hsu Lin
Meeting Room：3G