CPMT APM Joint Symposium Agenda on March 14th, 2016
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Monday, March 14, 2016 Shanghai International Convention Center Session I: Session Chair: Dr. Tim Chen | |||
*8:30-8:50 | Anisotropic Conductive Films (ACFs) Interconnection Technology for Wearable Electronics Applications Prof K. W. Paik, Korea Advanced Institute of Science and Technology(KAIST) | ||
*8:50-9:10 | 2D Heat Dissipation Materials for Microelectronics Cooling Applications Prof. Johan Liu, Shanghai University; Chalmers University of Technology | ||
*9:10-9:30 | Dielectric and Fluidic Properties of Epoxy Molding Compound for BGA Packaging Sean J. Fok, Tecore Synchem, Inc. | ||
9:30-9:45 | Sputtering conditions of Cu hillock formation for solid-state bonding Sho Akutagawa, The Institute of Scientific and Industrial Research (ISIR), Osaka University | ||
9:45-10:00 | Directly Electroless-plating Ni-P Thin-film to Fabricate Magnetic Core of Integrated Inductor for Printed Circuit Board Xiaolan Xu, University of Electronic Science and Technology of China | ||
10:00-10:15 | Sn-3.0Ag-0.5Cu composite solder reinforced by multilayer graphene Yilong Huang, Harbin Institute of Technology | ||
10:15-10:30 | Locally Reinforced Polymer-based Composites for Efficient Heat Dissipation of Multiple Heat Sources Xiaobing Luo, Huazhong University of Science and Technology | ||
10:30-10:45 | Coffee Break | ||
Session II: Session Chair: Xiaohua Tan | |||
10:45-11:00 | Fabrication of Copper Nanowire/Polyurethane Stretchable Conductors by a high intensity pulsed light method Su Ding, Harbin Institute of Technology | ||
11:00-11:15 | Silver Bonding Wire for BSOB/BBOS Zhi Ren，Niche-Tech Corporation Limited | ||
11:15-11:30 | Study on precipitation and dissolution of interfacial Cu6Sn5 during thermomigration Yi Zhong，Dalian University of Technology | ||
11:30-11:45 | A Facile Method to Transfer Vertical Aligned Graphene Film/Polydimethylsiloxane Composite to Thermal Interface Materials Haoming Fang, Peking University | ||
11:45-13:15 | Lunch Break | ||
Session III: Session Chair: Prof. Yanhong Tian | |||
*13:15-13:35 | Epoxy molding compound for Fingerprint Sensor Takeshi Mori, Sumitomo Bakelite Co., Ltd. | ||
13:35-13:50 | Comparative study of anhydride-based and amine-based underfill materials for flip chip applications Gang Li, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences | ||
13:50-14:05 | Flip Chip Bonding and Underfill Encapsulation for High Voltage LED Packaging Jeffery C. C. Lo, Center for Advanced Microsystems Packaging, HKUST | ||
14:05-14:20 | A new micro-silver paste for high power semiconductor devices Performance Jinting Jiu, Osaka University | ||
14:20-14:35 | A Facile Ultra Sound----Assisted Fabrication of Graphene Nanosheets----Silver Nanowires Hybrid nanomaterial And Their Application to Electrically to Electrically Conductive Adhesives Yanqing Ma, Shihezi University | ||
14:35-14:50 | Research on Snsbni solder Joints between LED chip and heat sink Wei Liu, PKUSZ | ||
14:50-15:05 | Measurement of DC and High Frequency Electrical Characteristics for TSV Li Cheng, Institute of Microelectronics, Tsinghua University | ||
15:05-15:20 | Coffee Break | ||
Session IV: Session Chair: Dr. Guoping Zhang | |||
15:20-15:35 | Sintering behave of copper submicron particle paste for low temperature bonding Gao Yue, Osaka university | ||
15:35-15:50 | Highly Efficient and Stable Quantum Dots Luminescent Microspheres for High-Performance White Light-Emitting Diodes Kai Wang, South University of Science and Technology of China | ||
15:50-16:05 | Electrically Conductive Adhesives Based on Thermoplastic Polyurethane Filled with Carbon Nanotubes Jie Luo, Suzhou Institute of Nano-tech and Nano-bionics, CAS | ||
16:05-16:20 | A NOVEL MECHANISM OF SILVER MICROFLAKES SINTER JOINING Hao, ZHANG, Institute of Scientific and Industrial Research, Osaka University | ||