Monday, March 16, 2020 Shanghai International Convention Center
Meeting Room: 5B+5C
Joint Session: Symposium VII and Symposium VIII-3D Heterogeneous Integration
Session Chairs: Qinghuang Lin
**10:00–10:30 | Diversity, Interconnect and Phase change: Semiconductor heterogenous integration and supper intelligence in the post Moore's Law era |
Hu Chuan, Guangdong Academy of Sciences | |
**10:30–11:00 | 3D Heterogeneous Integration |
Bill Bottoms, 3MTS | |
**11:00–11:30 | Recent Achievements and New Technologies for High Performance Mems Sensors and Actuators |
Philippe Robert, CEA-LET | |
**11:30–12:00 | 3D Packaging Development for HPC and 5G Applications |
Dr. Chiang Shiuh-Kao, Prismark | |