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Distinguished Conference Keynote Speakers
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Dr. Martin van den Brink President and Chief Technology Officer ASML |
Dr. Gerald Yin Chairman and CEO AMEC |
Dr. Marvin Liao Vice President, APTS TSMC |
Dr. Feng Hong CEO ICLeague Technology |
Plenary Session
| 9:00-12:00, Tuesday, June 14, 2022 | |
| Microsoft Teams | |
| Moderator: Dr. Beichao Zhang, AVP, HFC Semiconductor, China | |
| 9:00-9:35 | Opening Ceremony |
| 9:00-9:15 | Opening Remarks by Conference Chair -Dr Hanming Wu, Academician of Chinese Academy of Engineering, Dean of the School of Micro-nano-Electronics Zhejiang University |
| 9:15-9:20 | Opening Remarks by SEMI -Mr. Lung Chu, VP of SEMI and President of SEMI China |
| 9:20-9:27 | Presentation of Best Student Paper Awards -Sponsored by Fujifilm and ZJU-Hangzhou Global Scientific and Technological Innovation Center |
| 9:27-9:35 | Presentation of Best Young Engineer Paper Awards -Sponsored by Fujifilm and ZJU-Hangzhou Global Scientific and Technological Innovation Center |
| 9:35-10:10 | Driving Moore's Law into the Next Decade |
| Dr. Martin van den Brink | |
| President and Chief Technology Officer, ASML | |
| 10:10-10:45 | Micro-Fabrication Equipment, the Foundation of Digital Revolution and Beyond |
| Dr. Gerald Yin | |
| Chairman and CEO, AMEC | |
| 10:45–11:20 | Advanced 3D Chiplet Packaging Technology and Manufacturing |
| Dr. Marvin Liao | |
| Vice President, APTS, TSMC | |
| 11:20–11:55 | An Innovative 3D HITOC 4F2 DRAM Architecture |
| Dr. Feng Hong | |
| CEO, ICLeague Technology | |
Symposium Sessions
Symposium I: Device Engineering and Memory Technology
Symposium II: Lithography and Patterning
Symposium III: Dry & Wet Etch and Cleaning
Symposium IV: Thin Film, Plating and Process Integration
Symposium V: CMP and Post-Polish Cleaning
Symposium VI: Metrology, Reliability and Testing
Symposium VII: Packaging and Assembly
Symposium VIII: MEMS, Sensors and Emerging Semiconductor Technologies
Symposium IX: Design and Automation of Circuits and Systems
Training Course
| Workforce Development | Development of CMOS Integrated Process |