SEMICON China - 同期研讨会/活动 - 先进封装技术论坛


·LED China论坛 2014

00 00 小时 00 分钟 00

日期:2014年3月20日 (星期四)
地点:Pudong Ball room 2+3, 上海浦东嘉里大酒店


Nowadays, electronic products, Smart Phone, tablets, wearable device, are becoming shorter, smaller, thinner, and lighter. To meet these requirements, we need to scale down the device node according to Moore’s Law. However, as the scale of the device node shrinks, Moore’s Law has reached its limit. Advanced Packaging Integration is alternative way to drive performance.

In conjunction with SEMICON China 2014, SEMI China will organize Advanced Packaging Technology Forum, which will discuss the solution of Advanced Packaging, including 2.5D/3D packaging, WLP, Cu Pillar, High density TSV technologies, and analyze the market trend of these technologies. This forum provides a great platform for engineers, researchers and other industry peers to discuss advanced engineering and scientist information, ideas and solutions in the industry. It offers a good opportunity to reach customers from the china local IC industry.

Market Analysis of Advanced Packaging
Approaches Overview of Advanced Packaging Technologies
New Materials in Advanced Packaging Integration
Testing of Advanced Packaging Integration
Modeling of Advanced Packaging Integration
Roadmap Discussion of Advanced Packaging in China
Challenges of Advanced Packaging Development in China

Executives, Experts, engineers, researchers, scholars related to auto-motive electronics design, manufacturing and service

Oral Presentation Materials :
SCC 2014 PPT Template


Dr. Yifan Guo
Vice President of Engineering, ASE Shanghai

13:00 - 13:10 Opening Remark
Tom Salmon
Vice President, Global Member Services & Standards, SEMI
13:10 – 13:40 The evolvement of IC & packaging
1 Dr. Ed Chang
Director, China Business Development, TSMC
13:40 – 14:10 3D Integration Opportunities and Plating Challenges
1 Dr. Zhenqiu Liu
Director of Wet Process Engineering, TEL, USA
14:10 – 14:40 New Opportunity of Advanced Packaging Process Equipment
1 Peijun Ding
Vice president, Beijing NMC Co.,Ltd.
14:40 – 15:10 Advanced CSP & Turnkey Solutions
1 Fumio Ohyama
Deputy Chief Sales Officer, Tera Probe

15:10 – 15:40 Innovative Advanced Package Solutions for Mobile Application
1 Chang-Yi (Albert) Lan
Senior Director, SPIL

15:40 – 16:10 3D-IC beyond smartphones
1 Gregory Smith
VP of Teradyne, Computing & Communications Business Unit

16:10 – 16:40 Panel Level Packaging Technologies as Enabler for Innovative Mobile Devices
1 Rolf Aschenbrenner
IEEE Fellow / Deputy Director, Fraunhofer IZM,

16:40 -16:50 Closing and lucky draw (Huawei P6S Smart Phone)

Mr. JY Zhang

Tel: 86-21-60278556
Email: [email protected]

Ms. Stacy Zhang
Tel: 86-21-60278552
Email: [email protected]