|Dr. Yifan Guo
Vice President of Engineering, ASE Shanghai
Dr. Guo Yifan is currently Vice President of Engineering at ASE Assembly & Test (Shanghai) Ltd overseeing the engineering, research and development team for IC assembly and package technology. He has over 20 years of research and manufacturing experience in the field of IC packaging, including optoelectronic devices, MEMS, flip-chip and wafer-level packaging (WLCSP) and SiP module assembly.
Prior to joining ASE, Dr. Guo worked at Skyworks, IBM and Motorola respectively.
Dr. Guo has published more than 40 papers in renowned scientific journals as well as presented more than 50 papers in international conferences. He has also organized and chaired international industry conferences and forums. He has collaborated with industry experts and professors to publish seven professional literature and higher educational textbooks. He currently holds seven patents, and has another four under application.
Dr. Guo has a Ph.D degree in engineering science and mechanics from the Virginia Polytechnic Institute & State University, and also earned an MBA degree from the School of Business, Redlands University.