Plenary Session

CSTIC 2016,  Sunday, March 13, 2016

SHICC 上海国际会议中心 

08:45 – 09:35

Opening Ceremony,


Opening Remarks by Conference Chair


Opening Remarks by SEMI


Opening Remarks by ECS


Opening Remarks by Chinese Government Representatives


Presentation of ECS Best Student Paper Awards and SEMI Best Young Engineer Paper Awards



Meeting Room

3rd Floor Auditorium



09:35 – 10:20


Group Vice President
General Manager of Volume MEMS & Analog Division



10:20 – 10:40

Coffee Break



10:40 – 11:20

Dr. Chia-Hong Jan
Sr. Intel Fellow and director of system-on-chip (SoC) technology integration for the Technology and Manufacturing Group

The Day After 50 Years of Moore’s Law - Challenges, Prospects, and Opportunities



11:20 – 12:00


Qing Chu

Vice President,Huawei Technologies Co., Ltd.



12:00 – 13:30

7th Floor Grand Ballroom 1



 Panel Discussion

Meeting Room: 3B

17:00-18:00           Main challenges in Finfet manufacture

Moderator: Dr. Cor Claeys

Panel Members: Dr. Ru Huang, Dr. Min-hwa Chi, Dr. Chia-Hong Jan, Dr. Shaofeng Yu, Dr. Huilong Zhu, Dr. Yang Pan

Parallel Symposium Oral Sessions 

Sunday, March 13, 2016



13:30 – 18:00

Parallel Symposium Oral Sessions


Coffee Break


Conference Poster Session




Parallel Symposium Oral Sessions




Joint Sessions


Symposium II and Symposium III-Lithograpy/Etch joint session 

Sunday, March 13, 2016


Shanghai International Convention Center

Meeting Room: 3H+3I+3J 

Session Chairs: Kafai Lai (IBM) and Ying Zhang (Applied Material)




Opening Remarks


Kafai Lai / Ying Zhang


Moore's Law: No End in Sight


Vivek Singh, Intel


Atomic Level Precision Materials Engineering


Peter Loewenhardt, Applied Materials


Development of 250W EUV light source for HVM  lithography


Mizoguchi, Giaphoton


Materials Innovation for Cost-Effective Lithography


Ralph Dammel, EMD / AZ


Coffee Break





Symposium II and Symposium XI-DTCO Joint session

 Monday, March 14, 2016


Shanghai International Convention Center

Meeting Room: 3H+3I+3J
Session chairs: Leo Pang / Yiyu Shi




Opening Remarks

Leo Pang / Yiyu Shi


Nanolithography and Design Technology Co-optimization in Extreme Scaling

David Pan, UT Austin


Wearable &  Implantable Medical application – a  challenge to integrated RF transceiver design 

Zhihua Wang, Tsinghua University


The Next Frontier in IC Design: Determining (and Optimizing) Robustness and Resilience of Integrated Circuits and Systems

Ulf Schlichtmann, Technical University of Munich


Coffee Break


Symposium I: Device Engineering and Technology

Symposium II: Lithography and Patterning

Symposium III: Dry &Wet Etch and Cleaning

Symposium IV:Thin film and Process Integration

Symposium V: CMP and Post-CMP Cleaning

Symposium VI: Materials and Process Integration for Device and Interconnection (joint session with Symposium IV)

Symposium VII: Packaging and Assembly(CPMT APM Joint Symposium)

Symposium VIII: Metrology, Reliability and Testing

Symposium IX: Emerging Semiconductor Technologies

Symposium X: Advances in MEMS and Sensor Technologies

Symposium XI: Circuit Design, System Integration and Applications

Symposium XII: Si Materials and Photovoltaic Technology


Conference Banquet

Sunday, March 13, 2016
Banquet fee

Online Registration link;

18:30 – 20:00 Conference Banquet, 上海小南国国会店(

Hotel Floor Layout