Donghui Lu, Ph.D 卢东晖博士
Vice President, NAND Design, Technology and Manufacturing Group, Intel
英特尔副总裁,存储设计, 技术, 和研发部

个人简介 / Biography

Donghui is currently responsible for developing and deploying future generations of 3D NAND process technologies. He joined Intel in 2000 as Technology Development (TD) Process Engineer in Santa Clara, California and worked on many generations of logic/memory technology development and manufacturing ramp. Since 2015 he has played a critical leadership role in growing Intel’s memory business from $1+ Billion USD in 2015 to $5.4 Billion in 2020, including converting Dalian site to 3D NAND manufacturing, transferring 3D NAND and Optane technologies from Micron, and managing Dalian Fab Expansion project with record duration and cost. Since 2018, Donghui co-led the formation and growth of Dalian Technology Development (DTD) to a 300+ strong TD organization that successfully delivered Intel’s first independently developed 144-tier 3D NAND technology in 2020.

Donghui has a bachelor’s degree from Tsinghua University in Beijing, and Ph.D. from The Ohio State University in Columbus, Ohio, both in Materials Science and Engineering. He also received dual Executive MBA degrees from University of California at Berkeley, and Columbia University in New York.

摘要 / Abstract

“In the new data centric era, driving innovations in memory technology and storage architecture is one of the key business strategies for Intel. This talk will present Intel's leadership in 3D NAND and how it is driving momentum in connected platforms to meet customer needs, and Intel’s plans for both technology and manufacturing for the rapidly increasing market demands”.