Brian Kim
COO, Semiconductor Global Solutions
CEO, Triple Cores Technology


"Brian Kim" , the founder and CEO of Triple Cores Technology and now COO of Semiconductor Global Solutions, has led his "China Life" for 17 years, which is almost same span with China's semiconductor foundry manufacturing period started at year 2001.His 1st engagement was to support SMIC 1st wafer manufacturing fab in Shanghai with the tile of Project Manager of Applied Materials ( AMAT) back to year 2001. From then on, Brian has established a considerable trace and influence on steady growth of China Semiconductor market.

Working in Applied Materials for 16 years, Mr.Kim opened a new business platform of Turn-Key wafer Fab relocation business for the 1st time in Semiconductor industry world-wide back in year 2003. Before AMAT, he used to work at Hynix Semiconductor as a memory fab R&D staff. Brian has a master degree at Solar Cell Engineering.


Being in line with a government driven Semiconductor strategy named MIC 2025 ( Made in China 2025),around 62 new IC-facilities in addition to existing 79 working fabs are either under progress or announced to go in coming years in China.

One of key targets of MIC2025 is to have China increase its self-sufficiency rate for integrated circuits to 40% by 2020 and upto 70% by 2025, and, at the same time, aim to cover 46% of global Foundry TAM ( USD78B) thru the incremental foundry capacity from both Chinese local facilities and foreign IC manufactures in China by 2025.

If these targets are all achieved, Chinese Semiconductor market is expected to keep ave.20% CAGR till the time of 2025, which is great but also challengeable goal.

One of major hurdles for this aggressive goals may come from a sort of geopolitical reason inside of China. It is well known that each province in China tends to compete each other to host as many IC facilities as possible within its territory with underestimating two important facts which may keep strong influence for achieving the goals.

1. IC Fab needs suitable supply chain and resources in reasonably close distance in order to keep the facilities and manufacturing healthy regardless of having right IC manufacturing technologies or not.

2. China is geographically a big country, and many of IC fabs are scattered at a far distance instead of gathering near. Benchmarking the fab locations in Korea and Taiwan, IC Fabs in China tend to be born with less synergy in terms of suitable fab service infrastructure.

At given situation of China IC industry, a new mega size global service platform has now been prepared in China. In order to fulfill the gap of services coming from most of foundry wafer fabs in China, this new service company aims to support a customized service platform to each wafer fab who does not have proper self- man-power and supply chains on site, located far away from Shanghai areas.

The details will be delivered from the presentation of this Conference at 11am on March 16, Friday, at New Tech Stage Hall E7.