Dr. David Haynes
Vice President of Specialty Technologies and Strategic Marketing, CSBG, Lam Research Corp.

讲师简介 / Speaker Bio

David gained a B.Eng and PhD in Materials Engineering from Swansea University. His PhD thesis was in the field of organic semiconductors for electronic and optoelectronic applications.
In his professional career, David has accrued more than 25 years of experience in the Semiconductor Capital Equipment and research instrumentation sectors. Focused on new technology development, he has a strong process background in plasma etch and deposition for optoelectronics, photonics, MEMS, Power and RF Electronics, as well as advanced chip packaging technologies.
Building on this technical knowledge, David has a proven track record in developing strategic business partnerships, specializing in new technology developments and introduction of enabling process capabilities to leading semiconductor fabs worldwide.
David Joined Lam Research in June 2016. He is currently Vice President of Strategic Marketing in Lam’s Customer Support Business Group and is responsible for Lam’s strategy in Specialty Technologies.

摘要 / Abstract




在本演讲中,我们为大家介绍如何通过最新发布的Syndion® GP产品解决这些挑战。我们将呈现我们的深硅刻蚀硬件和工艺能力的开发如何显著改进晶圆上的结果并支持下一代功率器件的制造。这些挑战包括工艺生产力的持续提高、轮廓控制的改进、实现更平滑的刻蚀侧壁、以及提升刻蚀深度和特征关键尺寸的均匀性。