Dr. Daquan Yu 于大全
Distinguished Professor of Xiamen University, CEO of Xiamen Sky Semiconductor Co., Ltd.

个人简介 / Biography

Dr. Daquan Yu is a Distinguished Professor of Xiamen University and the CEO of Xiamen Sky Semiconductor Co., Ltd. He was the President of Research Academy of Advanced Packaging Technology of TSHT Group from 2014 to 2019. Before that, he was a professor of Institute of Microelectronics, Chinese Academy of Sciences from 2010 to 2015. He had carried out research work at Fraunhofer IZM in Germany, and Institute of Microelectronics in Singapore from 2005 to 2010. He has authored or co-authored more than 190 peer-reviewed technical publications and holds more than 70 patents. He is a member of the Expert Committee of the 02 National Science and Technology Major Program of China, vice president of MEMS branch of China Semiconductor Industry Association, and a Senior member of IEEE.

摘要 / Abstract

Wafer level packaging and integration is very important for 5G device integration. Wafer level Fan-in can be used for SAW/BAW filters and IPD, RF modules. Wafer Level Fan-out can be used for RF modules and mmWave chips. Recently, glass wafer level packaging using through glass via (TGV) technology and embedded glass fan-out (GFO) technology become more and more mature. They can be used for 3D integration for IPD, mmWave, RF module. The advantages of glass wafer packaging include small form factor, low cost, simple process, and excellent electrical performance. There are still a lot of innovation works for the development of Wafer Level System Integration Technology for various 5G applications.