ZHENG Li

Board Director & Chief Executive Officer, JCET Group

Mr. Zheng Li is the Chief Executive Officer and Board Director of JCET Group. He holds a Master’s degree in Economics from the University of Tokyo and a Bachelor’s degree in Industrial Management Engineering from Tianjin University. A seasoned professional in the integrated circuit industry, Mr. Zheng brings over 30 years of global experience across the United States, Japan, Europe, and China. He has previously held senior executive roles including Senior Vice President at SMIC, Global Senior Vice President and President of Greater China at NXP, and CEO of Renesas Electronics Greater China.

Mr. Zheng currently serves as a member of SEMI’s International Board of Director, Vice Chair of the China Semiconductor Industry Association (CSIA), Rotating Chair of the CSIA IC Packaging & Testing Committee, Vice Chair of the China Integrated Circuit Innovation Alliance, Rotating Chair of the China IC Packaging & Testing Innovation Alliance, and Vice Chair of the Shanghai Integrated Circuit Industry Association.

Speech Abstract:

Redefining Chip Manufacturing Through Atomic‑Level Innovation in Advanced Packaging

In the post‑Moore era, atomic‑level packaging has emerged as a central pathway for industry advancement. By delivering breakthrough innovations in precision, interconnect density, and heterogeneous integration, it is fundamentally reshaping the rules of chip manufacturing and establishing a new production paradigm. This shift has become a critical enabler for the continued scaling of AI computing power and is set to propel the semiconductor industry toward a new ecosystem defined by system‑level expansion and scalability.