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March 20-22, 2019
Shanghai New International Expo Centre

Advanced Manufacturing Forum

Advanced Manufacturing Forum

Date: Thursday, March 21, 2019
Venue: Kerry Hotel Pudong, Shanghai

Attendee Registration   Previous Review

Catalyzed by the market outlook, policy and the national fund, heat on Semiconductor industry continuously accumulate. There are many 12inch Fabs planned for the next 5 years, OSAT is expending accordingly. It is easy to build factory but difficult to make it strong and profitable. How the China Semiconductor manufacturing industry is going to enhance the core competency? How to prioritize resource, re-visit the business model, and cooperate within the ecosystem?

The high-end market is occupied by 7nm, 10nm, 14/16nm, however, 28/40nm provide most revenue to TSMC. Meanwhile, UMC and GF has abandoned the 14nm and above process development. So for Fabless, FAB, Equipment and material companies, how to make balance between the cost and performance to countinue their owner advance manufacturing development.

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Agenda / 议程
   
Moderator  
   
09:30-09:35 Welcome speech 欢迎致辞
   
09:35-10:00
打造中国高端集成电路装备的大国重器
Peijun Ding 丁培军
President, NAURA
北方华创,总裁
   
10:00-10:25 Marketing EVP, HHGrace
HHGrace, 市场部EVP
   
10:25-10:50 Lam Research
   
10:50-11:15 Qualcomm(Intend toinvite)
高通(拟邀请)
   
11:15-11:40

Kaitsuka Takanobu 贝塚考亘
Fundamental Technology Development Department, TEL
TEL, 先端半导体技术部部长
   
11:40-12:05 SMIC(Intend toinvite)
中芯国际(拟邀请)