SEMICON China - SESSIONS / EVENTS - "More than Moore" Technology Forum

Concurrent Technology Forums

·More-than-Moore Technology Forum
·China Equipment Market Forum
·IC Applications from Design to Manufacturing Forum
·Advanced Packaging Technology Forum
·LED China Conference 2014 ·Wearable Device Tech Forum

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Date: Wednsday, March 19, 2014
Pudong Ball room 2+3, Kerry Hotel Pudong, Shanghai
Language: English 


Since the early 70’s, the semiconductor industry ability to follow Moore’s law has been the engine of a virtuous cycle: through transistor scaling, one obtains a better performance-to- cost ratio of products, which induces an exponential growth of the semiconductor market. This in turn allows further investments in semiconductor technologies which will fuel further scaling. The industry is now faced with the increasing importance of a new trend, “More than Moore” (MtM), where added value to devices is provided by incorporating functionalities that do not necessarily scale according to "Moore's Law“.

Applications like Sensor, High Power, High voltage, LED driver, Automotive, Internet-of- things, RF, mmWave make developing novel MtM technologies on top of the Moore's Law technologies a more important issue. That's what gave rise to MtM, which is symbiotic with Moore's Law and allows non-digital functionalities to migrate from the system board-level into the package (SiP) or onto the chip (SoC).

In conjunction with SEMICON China 2014, SEMI China will organize “More than Moore Technology Forum”, which focuses on "Internet-of-Things Application driven MtM innovation". This forum provides a great platform for engineers, researchers and other industry peers to discuss advanced engineering and scientist information, ideas and solutions in the industry. It offers a good opportunity to reach customers of China local IC industry.

MEMS/Sensor Technologies
RF/mmWave Technologies
CMOS image sensors
High voltage, High Power, LED driver
IP Needed in More than Moore world

Executives, Experts, engineers, researchers, scholars related to auto-motive electronics design, manufacturing and service

Oral Presentation Materials :
SCC 2014 PPT Template

Conference Host Dr Yumin LU, VP of technology, SITRI
8:00 - 8:20 Registration
8:20 - 8:30 Opening Remark
8:30 – 9:00 Risks and Strategies for IP Protection in Semiconductors
1 Shaobin Zhu
Attorney-at-Law, Finnegan, Henderson, Farabow, Garrett & Dunner, LLP

9:00 – 9:30 The MEMS sensors integration path
1 Leopold Beer
Regional President Asia Pacific, Bosch

9:30 – 10:00 Manufacturing Technology of High Voltage Power Devices and its Challenges
1 Dr. Sheng'an Xiao
Senior Director of Advanced Modules, HHGrace

10:00 – 10:30 TowerJazz - The Global specialty Foundry Leader

Dani Ashkenazi
Vice President of Sales for APAC & Israel, TowerJazz


10:30 – 11:00 Altis helps you build the new generation of IoT applications
1 Javen Tan
Director, APAC and Japan, Altis Semiconductor

11:00 – 11:30  

Qixing Liu
Director, ASMC

11:30 – 12:00 Wafer Level SiP Technology - Full 3D Architecture for Future Sensors
  Albert Ou
Director, Corporate R&D, ASE Group
12:00 -12:10 Closing and lucky draw (Huawei P6S Smart Phone)

Mr. JY Zhang
Tel: 86-21-60278556
Email: [email protected]

Ms. Stacy Zhang
Tel: 86-21-60278552
Email: [email protected]