为了您获得更好的浏览体验,请将您的浏览器更新到最新版本!
+86.21.6027.8500
English
March 17-19, 2021
Shanghai New International Expo Centre

Advanced IC Manufacturing Forum

Advanced IC Manufacturing Forum

Date: Sunday, June 28, 2020
Time: 09:20 – 11:50
Venue: Pudong Ballroom 1+2+3, Kerry Hotel Pudong, Shanghai

Attendee Registration   Previous Review

It has been 61 years since the invention of integrated circuits. Driven by Moore's law, the width shrinks every year and the performance keeps improving, the high-end market is occupied by 7nm, 10nm, 14/16nm, 5nm will be mass production in TSMC soon, Intel's 7nm process going well and 5nm is under develop. Finfets have been invented for years, can new technologies like the negative capacitance field effect transistor (NCFET) continue to drive the industry? In this forum, we will invite TSMC, EDA, Researching institution, analisys institution, domestic and foreign equipment manufacturers to discuss together.

SPONSORS

 
         
Agenda / 议程
   
09:20 – 11:50 Moderator / 主持人
Richard Jiang, VP, PNCS
蒋庭明,副总裁,至纯科技
   
09:20 – 09:45
3D Characterization and Analysis Workflows: Accelerating Insights, TtD & TtM
Kong Tjien Lim, Director, Semiconductor, Thermo Fisher Scientific
林光健,赛默飞世尔科技,半导体事业部中国区业务总监
   
09:45 – 10:10
A New Era of Supply Chain Collaboration: Driving Socially Responsible Semiconductor
Jeff Cheng, Head of TSMC Nanjing Quality & Reliability organization
郑吉峰,台积电(南京)有限公司品质暨可靠性组织负责人
   
10:10 – 10:35
Opportunity of China's 300mm Wafer Supply
中国制造300毫米大硅片的机遇

Dr. Wei Li, Chairman, Zing Semiconductor Corporation
李炜 博士,上海新昇半导体科技有限公司董事长
   
10:35 – 11:00
Accurate etch modeling with high-volume metrology and deep-learning technology
Wei Yuan, ICRD, Assistant Process technology Director
袁伟,上海集成电路研发中心,技术研发部副部长
   
11:00 – 11:25
THE BRIDGE of Fab & Fabless
Actel Niu,Mentor, A Siemens Business,Account Technical Manager
牛风举,明导电子,资深技术经理
   
11:25 – 11:50
Materials for Emerging Device Applications
Jiaqi Tian, Market Analyst, TECHCET LLC
田嘉齐,市场分析师,TECHCET LLC