Advanced IC Manufacturing Forum

Date: Sunday, June 28, 2020
Time: 09:20 – 11:50
Venue: Pudong Ballroom 1+2+3, Kerry Hotel Pudong, Shanghai

Attendee Registration   Previous Review

It has been 61 years since the invention of integrated circuits. Driven by Moore's law, the width shrinks every year and the performance keeps improving, the high-end market is occupied by 7nm, 10nm, 14/16nm, 5nm will be mass production in TSMC soon, Intel's 7nm process going well and 5nm is under develop. Finfets have been invented for years, can new technologies like the negative capacitance field effect transistor (NCFET) continue to drive the industry? In this forum, we will invite TSMC, EDA, Researching institution, analisys institution, domestic and foreign equipment manufacturers to discuss together.


Agenda / 议程
09:20 – 11:50 Moderator / 主持人
Richard Jiang, VP, PNCS
09:20 – 09:45
3D Characterization and Analysis Workflows: Accelerating Insights, TtD & TtM
Kong Tjien Lim, Director, Semiconductor, Thermo Fisher Scientific
09:45 – 10:10
A New Era of Supply Chain Collaboration: Driving Socially Responsible Semiconductor
Jeff Cheng, Head of TSMC Nanjing Quality & Reliability organization
10:10 – 10:35
Opportunity of China's 300mm Wafer Supply

Dr. Wei Li, Chairman, Zing Semiconductor Corporation
李炜 博士,上海新昇半导体科技有限公司董事长
10:35 – 11:00
Accurate etch modeling with high-volume metrology and deep-learning technology
Wei Yuan
11:00 – 11:25
THE BRIDGE of Fab & Fabless
Actel Niu,Mentor, A Siemens Business,Account Technical Manager
11:25 – 11:50
Materials for Emerging Device Applications
Jiaqi Tian, Market Analyst, TECHCET LLC
田嘉齐,市场分析师,TECHCET LLC