Calvin Lee
Director, Corporate R&D, ASE Group


Calvin Lee is currently the Director of Corporate R&D, ASE Group, leading the team of 3D IC SiP Technology Division and Package Characterization Division. He focuses on 2.5D IC package of New Product Introduction (NPI) and the development of 3D IC packaging technology. And, he also has the experience working in the Labs of Package Characterization for over 15 years. Mr. Lee received his B.S. degree and M.S. degree in mechanical engineering from National Cheng Kung University and National Sun Yat-sen University, Taiwan. He has held 10 patents and published more than 20 technical publications on electronic packaging during his career at ASE.