Dr. Hyungjun KIM
Yonsei University, South Korea

Hyungjun Kim is an associate professor at department of materials science and engineering at Pohang University of Science and Technology (Postech), Korea. His main research interests include advanced thin film technology and nano scale device fabrication. Before he joined the faculty of Postech in 2004, he was a research staff member in the Silicon Technology Department, IBM Research Division (Yorktown Heights, NY). He pioneered plasma-enhance atomic layer deposition (PE-ALD) of metals and nitrides for Cu interconnect technologies and explored various thin film processes for for CMOS and novel nano devices fabrication. Dr. Kim is an author of more than 70 technical publications and filed or awarded more than 10 U.S. patents. He has also presented his work at numerous technical conferences and is active in conference organizing. He served as an organizing chair for 2006 ALD topical conference on atomic layer deposition in Seoul, Korea. Currently, he is a member of organizing committee at thin film division of AVS and topical conference on atomic layer deposition since 2003 He is a editorial board member of Thin Solid Films, Metals and Materials International, J. Korean Vacuum Society, and J. of Korean MRS. Dr. Kim received his Ph.D. degree in materials science and engineering from University of Illinois (Urbana-Champaign, 1998), and B.S. and M.S. degrees in the Inorganic Materials Department at Seoul National University (1990 and 1992, respectively). Dr. Kim is a member of the Institute for Electrical and Electronics Engineers and American Vacuum Society.