Adrian Arcedera
Vp of MEMS and Sensors product of Amkor

Adrian joined Amkor in 1997, and has served in various positions in product and business development and management of Amkor’s chip scale products, including leading the platform development for Amkor’s ChipArray® package. Currently Adrian is responsible for the business and platform development for MEMS & Sensor Products. Prior to joining Amkor, Adrian was a materials engineer for Motorola in the Philippines. He holds a degree in Chemical Engineering from the University of the Philippines.

Abstract：
The basic building blocks for the Internet of Things have been around for over 2 decades. Connectivity, Memory, Microprocessor, and Microcontrollers have all benefited from using standard IC Packaging Platforms, except for MEMS Sensor /Devices. MEMS devices are not standard integrated circuits. The creative wafer fabrication techniques gave birth to Si-based transducers and actuators that respond to or interact with external or environmental stimulus. On the onset of MEMS packaging, cost and package form were not in the forefront as solving end market applications. This created a broad diversity of package form factors for almost every application and end market.

As the IoT market grows and transitions into high volume production, the drive towards Sensor Fusion, Integration and IoT Module assembly will become more critical. Assembly Packaging and Test standardization will be needed to offer cost competitive solutions without sacrificing performance. Among all the devices necessary for the IoT to be successful, none is more “sensitive” than the MEMS / Sensor device. The requirement of “controlling stress to the MEMS structure, while allowing stimulus to go through” remains the same whether the packaging solution is a discrete package like MLF or LGA or an IoT Module. A standard platform will be needed that can provide the flexibility to support multi-MEMS application and customizable on the inside while keeping it standard on the outside to maintain maximum compatibility during assembly, final test and surface board mount.