Donghui Lu, Ph.D.

Vice President, Co-General Manager, HVM Program Office
Intel Corpotation


Dr. Donghui Lu is Vice President of Intel's Manufacturing, Supply Chain, and Operations (MSO) and Co-General Manager of HVM Program Office (HPO). As Intel embarks on the "IDM 2.0" strategy, MSO is accelerating Intel's capacity expansions globally with world-class capabilities to support the critical demand for customers, and HPO is reponsible leading the integrated program management for all MSO new space enablement, from dirt to world-class product delivery, including MSO foundry enabling capabilities.

Prior to assuming his current role in July 2021, Donghui was Vice President of NAND Design, Technology and Manufacturing Group, and Director of Process Development at Dalian Memory Technology and Manufacturing, responsible for developing and deploying future generations of 3D NAND process technologies.

Donghui joined Intel in 2000 taking on many technical leadership role in Fab D2 in Santa Clara, California, then in Fab 68 in Dalian, China. Since 2015, Donghui played a critical leadership role in growing Intel NAND business by 5x to $5.4 Billion in 2020, including converting Fab 68 from legacy logic to a world class 3D NAND manufacturing operations while beating all benchmarks, building the second Dalian Fab in record 9 months from construction to tool move-in at world class cost, developing industry leading 144-layer 3D NAND process technology in 2020, and achieving breakthroughs on 200+ layer 3D NAND technologies in 2021.

Donghui has a bachelor's degree from Tsinghua University in Beijing, China, and a Ph.D. from Ohio State University in Columbus, Ohio, both in Materials Science and Engineering. He also received joint Executive MBA degrees from the University of California, Berkeley, and Columbia University, New York.