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| Onsite | |
| Date: | Monday-Tuesday, March 24-25, 2025 |
| Venue: | Shanghai International Convention Center 上海国际会议中心 |
| No.2727 Riverside Avenue Pudong, Shanghai 200120, China 中国上海浦东滨江大道2727号 |
Distinguished Conference Keynote Speakers
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| Plenary Session |
| Monday, March 24, 2025 | |
| Meeting Room: | 3rd Floor Auditorium |
| 08:15-08:45 | Registration |
| 08:45-09:25 | Opening Ceremony |
| Opening Remarks by Conference Chair | |
| Opening Remarks by SEMI | |
| Opening Remarks by IEEE EDS | |
| Presentation of the Best Student Paper Awards and the Best Young Engineer Paper Awards | |
| 09:25-10:00 | Heterogeneous Computing Solutions for Power-Performance Efficient On-Device AI |
| Dr. Giri Nallapati | |
| Vice President of Technology, Qualcomm Inc., USA | |
| 10:00-10:35 | From the Nanometer Scale to Light Years |
| Dr. Edmundo A. Gutiérrez D. | |
| General Director, INAOE, Mexico | |
| 10:35-11:10 | Chip Design for AI and AI for Chip Design |
| Dr. Tim Kwang-Ting Cheng | |
| Vice-President for Research and Development, The Hong Kong University of Science and Technology, China | |
| 11:10-11:45 | Materials Engineering Innovations to Address Next-Gen Electronics Packaging Challenges |
| Mr. Terrance Lee | |
| Corporate Vice President, GM, Applied Materials, USA | |
Symposium Sessions
Symposium I: Device Engineering and Memory Technology
Symposium II: Lithography and Patterning
Symposium III: Dry & Wet Etch and Cleaning
Symposium IV: Thin Film, Plating and Process Integration
Symposium VI: Metrology, Reliability and Testing
Symposium VII: Packaging and Assembly
Symposium VIII: MEMS, Sensors and Emerging Semiconductor Technologies
Symposium IX: Design and Automation of Circuits and Systems
Symposium X: AI & IC Manufacturing
Parallel Symposium Sessions
| Monday, March 24, 2025 | |
| 13:00-15:20 | Symposium Oral Session |
| 15:30-17:00 | Conference Poster Session |
| Tuesday, March 25, 2025 | |
| 08:30-17:00 | Symposium Oral Session |
Panel Discussion
| 16:30-18:00, Monday, March 24, 2025 | |||||||
| Meeting Room: 3rd Floor Yellow River Hall | |||||||
| Industry-University Co-Play for IC Chips: Challenges, Opportunities, and Prospects | |||||||
| Moderator: |
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Panelists: |
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Prof. Rui Zhang Zhejiang University |
Dr. Hongjie Liu Reexen Technology |
Prof. Qiang Wu Fudan University |
Dr. Xinchun Lu Hwatsing Technology |
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Dr. Yuan Lu Sai Microelectronics Inc. |
Prof. Chen Wang Tsinghua University |
Dr. Zongliang Huo Yangtze Memory Technology |
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Training Courses
| Tuesday, March 25, 2025 | ||
| Meeting Room: 5B+5C | ||
| 13:30-15:00 | SEMI U Tutorial: |
Photolithography and Related Technologies and Process Standards (Workforce Development) Speaker: Prof. Qiang Wu, Fudan University, China |
| 15:30-17:00 | SEMI U Tutorial: |
Advanced Package and 3DIC (Chiplets and HBM) (Workforce Development) Speaker: Dr. Guorong Li, Beijing NAURA Microelectronics Equipment Co., Ltd., China Speaker: Dr. Xia Jiang, JCET Semiconductor Integration (Shaoxing) Co., Ltd., China |