Symposium Chair: Dr. Steve X. Liang
| ** | to designate keynote talk - 30 min | |||
| * | to designate invite talk - 25 min | |||
| to designate regular talk - 15 min |
Sunday, March 22, 2026, Kerry Hotel Pudong, Shanghai
Meeting Room: Tower Room 1
Session I: Advanced Packaging and Heterogeneous Integration
Session Chair: Prof. Xing Wu
| **13:30-14:00 | From Earth to Orbit Proud to share a milestone from OIP Technology |
| Steve Jin, OIP Technology | |
| *14:00-14:25 | Addressing Electroplating Challenges in Advanced Packaging Using Modern Methods |
| Alexander Gaiduk, Nova | |
| *14:25-14:45 | Influences of the Deformable Chuck on Post Bonding Distortion During the Expansion Error Compensation in Wafer-to-Wafer Hybrid Bonding |
| Jiayang Li, Piotech Jianke (Haining) Semiconductor Equipment Co., Ltd. | |
| *14:45-15:05 | Investigating the Influences of Wafer Shapes and Stress Layers on Direct Wafer-to-Wafer Bonding Distortions |
| Jianing Liang, Yangtze Laboratory | |
| *15:05-15:25 | Effective Unknown Foreign Material Identification for Advanced Packaging Using Novel Submicron Infrared (O-PTIR) Microspectroscopy |
| Michael Lo, Photothermal Spectroscopy Corp | |
| *15:25-15:45 | Parallel Test Strategy for Chiplet Testing for HPC/AI devices: Leveraging SmarTest 8 Interleaved Testflow Mechanism |
| Jun Zhang, Advantest | |
| *15:45-16:05 | Thermally Induced Voids and Delamination In Cu RDL: Experimental And Simulation Study |
| Peng Xu, East China Normal University | |
| 16:05-16:30 | Coffee Break |
| 16:30-18:00 | Panel Discussion (Meeting Room: Pudong Ballroom 1) |
Monday, March 23, 2026, Kerry Hotel Pudong, Shanghai
| 16:00-18:00 | Coffee Break |
| 16:00-18:00 | Poster Session: Monday, March 23 (3F, Kerry Hotel Pudong, Shanghai) |
| 7-1 | A Novel Interface Characterization Technique for Hybrid Bonding Process Optimization |
| Masahiro Saito, Toray Research Center, Inc. | |
| 7-3 | V93000 Enabling High-Volume Test for Advanced Packaging and Chiplet Architectures |
| Kevin YAN, ADVANTEST | |
| 7-9 | Systematic TTV Control Strategy for Temporary Bonding in Advanced Packaging: From Low-TTV Carrier to Process Optimization |
| Yang Cheng, Shenzhen Institute of Advanced Electronic Materials | |
| 7-11 | Long Process Kits Lifetime in TiW Chamber for Wafer Level Packaging |
| Shiwei Zhang, Applied Materials China | |
| 7-12 | High Performance of Cluster Sputter for EMI Shielding and BSM |
| Xiaobo Li, Applied Materials China |