Symposium Chair: Prof. Bin Yu, Zhejiang University, China
| ** | to designate keynote talk - 25 min | |||
| * | to designate invite talk - 25 min | |||
| to designate regular talk - 15 min |
Sunday, March 17, 2024 Shanghai International Convention Center
Session I: Modeling & Simulation in Intelligent Systems
Meeting Room: 5F
Session Chair: Yunlong Li
| **13:30-13:55 | Neuromorphic Audio Edge Intelligence |
| Shih-Chii Liu, Institute of Neuroinformatics, University of Zurich and ETH Zurich | |
| *13:55-14:20 | In-memory Computing and Dynamic Vision Sensors: Recipes for tinyML in Internet of Video Things |
| Arindam Basu, Hongkong City University | |
| 14:20-14:35 | A Novel DES Encryption Circuit Based on RRAM XOR Gates |
| Haoxiong Bi, Zhejiang University | |
| 14:35-14:50 | A physical based 2D Monte Carlo Model of MO-ECRAM Programming for Device Optimization |
| Haotong Zhu, Peking University | |
| 14:50-15:05 | Coffee Break |
Session II: Future of Manufacturing: Industrial Insights
Session Chair: Yang Xu
| *15:05-15:30 | AI Empowers Semiconductor Yield Signoff Ecosystem - Reducing Cost and Increasing Efficiency for Manufacturing with a Diversified Supply Chain |
| Mark Lu, Semitronix Corporation | |
| *15:30-15:55 | The Application of Virtual Manufacturing in IC Process Development |
| Yunlong Li, Zhejiang University | |
| *15:55-16:20 | Depth-first convolution-neural-network pipeline for compute-in-memory architecture |
| Cimang Lu, Flash Billion | |
| *16:20-16:45 | Progress of AI for EDA Algorithms |
| Yu Han, Empyrean Technology Co., Ltd. |
Monday, March 18, 2024Shanghai International Convention Center
Meeting Room: 5F
Session III: Exploring Non-von Neumann Architectures
Session Chair: Jinfeng Kang
| **08:30-08:55 | Novel Data Storage Technology for AI |
| Xiangshui Miao, Huazhong University of Science and Technology | |
| *08:55-09:20 | Developing a Neuromorphic Computer: Practices and Challenges |
| Gang Pan, Zhejiang University | |
| *09:20-09:45 | Heterogeneous integration of analog and digital computing-in-memory technologies |
| Shaodi Wang, WITMEM Co., Ltd. | |
| 09:45-10:10 | The Integration of AI Large Model & Neuromorphic Computing in Memory with High Speed Analog Ics |
| Hongjie Liu, Shenzhen Reexen Technology Co., Ltd. | |
| 10:10-10:25 | Coffee Break |
Session IV: Co-optimization from Technology, Device to Design
Session Chair: Cheng Zhuo
| *10:25-10:50 | Nonvolatile emerging memory devices for energy-efficient edge AI accelerators |
| Daniele Ielmini, Politecnico Di Milano | |
| *10:50-11:15 | Snapdragon Platform for High Performance 5G Mobile SOC & AI/Computing Application Manufactured with 4nm EUV Fin-FET Technology and Beyond |
| Jun Yuan, Qualcomm | |
| *11:15-11:40 | Large Scale VLSI Mask Optimization |
| Bei Yu, The Chinese University of Hong Kong | |
| 11:40-11:55 | Universal Process Migration Solution of MAGICAL for Analog IC Layout Automation |
| Yufeng Wei, Fudan University | |
| 11:55-13:30 | Lunch Break |
Session V: AI Innovations in Semiconductor Manufacturing
Session Chair: Ye Lu
| *13:30-13:55 | Deep Neural Network Proxy Modelling for IC Virtual Fabrication |
| Dong Ni, Zhejiang University | |
| 13:55-14:10 | A SelectiveNet-based Method for Defect Classification in Semiconductor Manufacturing |
| Qian Jin, Zhejiang University | |
| 14:10-14:25 | AI driven process control by machine learning based virtual metrology for high product mix manufacturing |
| Chunshan Du, Siemens EDA | |
| 14:25-14:40 | Machine Learning Technologies for Semiconductor Manufacturing |
| LiFei Sun, Lam Research | |
| 14:40-14:55 | Deep-Learning-Based Proxy Modeling for Microscopic Process of Plasma Etching |
| Shuhang Chen, Zhejiang University | |
| 14:55-15:10 | Predicting Material Removal Rate in Chemical Mechanical Polishing (CMP) Using Explainable Machine Learning Methods |
| Jiahui Zuo, Zhejiang University | |
| 15:10-15:25 | Coffee Break |
Session VI: Advancements in Semiconductor Materials and Devices
Session Chair: Dong Ni
| *15:25-15:50 | Research on the application of artificial intelligence in device compact model and technology – circuits co-optimization |
| Ye Lu, Fudan University | |
| *15:50-16:15 | Vector Matrix Multiplication with Two-Dimensional Materials |
| Mario Lanza, KAUST | |
| 16:15-16:30 | α-In2Se3/MoTe2 heterojunction for p-type junction field-effect transistors with ferroelectric memory characteristics |
| Tianjiao Zhang, Zhejiang University | |
| 16:30-16:45 | Investigation of the Carrier Velocity in Short Channel Ge MOSFET with NiGe Metal Source/Drain |
| Jing Yan, Zhejiang University | |
| 16:45-17:00 | A First-Principles Study on the Stable Phase in Yttrium-Doped HfO2 |
| Xiaomin Xiao, Peking University | |
| 17:00-17:15 | Tiny Neural Network Representing MOSFET Physical Effect Sub-model |
| Shuhan Wang, Peking University | |
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Poster Session: |
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| Coffee Break | High-speed performance testing strategy and solution for AI wave |
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Zhexi Yan, ADVANTEST |
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Metal-Oxide-Metal Capacitor Simulation and Modeling by Virtual Fabrication |
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Qingpeng Wang, Lam Research |
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APPLICATION OF ADVANCED PROCESS CONTROL FOR IC MANUFACTURING |
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Linglie Zeng, Ontoinnovation |
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Study of Defectivity and Yield Impact from the Establishment and Optimization of FOUP Clean and FOUP Use Routine in Advanced IC Manufacturing |
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Zhigang Zhang, Brooks Technology (Shanghai) Limited |
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Anomaly Detection of CDSEM Images |
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Meng Xue, Shanghai Huali Microelectronics Corporation |
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PMOS leakage reduction through SiGe morphology & IMP profile fine tune |
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WenZhao Fu, Shanghai Huali Integrated Circuit Corporation |
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The Defect Formation and Reduction of 55NM Ultra-low Power (55ULP) BEOL Process |
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Qing Mao, Shanghai Huali microelectronics Corporation |
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A Novel GAN-based Data Augmentation Algorithm for Semiconductor Defect Inspection |
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Lilei Hu, Shanghai University |
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Simulation and study of the interaction between needle mark morphology and probe card |
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Chenxi Zhao, Shanghai Huali integrated Circuit Manufacturing Co., Ltd. |
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CONVOLUTIONAL NEURAL NETWORK (CNN) BASED PROCESS WINDOW ANALYSISING FOR LITHOGRAPHY |
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Zeyang Chen, School of Micro-Nano Electronics, Zhejiang University |
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Structure Optimization of NOR Flash for Improving Cell Performance |
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Jiayu Ma, Shanghai Huali Integrated Circuit Corporation |
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Improved EM Performance by Adjusting Etching Profile of Top Metal for 28HK Metal Gate Process |
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Zherui Cao, Shanghai Huali Integrated Circuit Co., Ltd. |
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Digitalization Solutions for Automated Material Handling Systems in Semiconductor Smart Factories |
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Ruiji Wang, Huaxin (Jiaxing) Intelligent Equipment Co., Ltd. |
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High-Performance of SOT-MRAM Based on Optimization of Integration Processes |
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Xiaofei FAN, Truth Memory Corporation |
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A novel deep neural network based algorithm for fast wafer effective carrier lifetime measurement using heterodyne lock-in carrierography |
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Lilei Hu, Shanghai University |
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A method for predicting the film thickness of IC deposited films based on FCBF-CatBoost |
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Cai Yu, University of Science and Technology of China |
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55NM ULTRA LOW LEAKAGE PLATFORM DEVELOPMENT |
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Yifan Ding, Shanghai Huali Microelectronics Corporation |
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High Performance Wafer Defect Classification Model Based on Feature Fusion and RGB SEM images |
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Zhongyu Shi, University of Science and Technology of China |
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DSA for Nickel Silicide Formation in Advanced Devices |
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Haifeng Zhu, Applied Materials |
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Surface Damage Matching between VIISta 550H and VIISta 1500H |
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Huang Zeng, Applied Materials |
| Model of Organic Ferroelectric Transistors for Neural Networks | |
| Kairui Ding, Nanjing University of Posts and Telecommunications | |