SEMICON China - CSTIC - CSTIC 2024 - Keynote & Invited Speakers

Conference Plenary Speaker (2024)

	Evolution of Moore's Law: a Perspective Dr. Peng Bai, CEO, Rong Semiconductor	New Materials vs New Geometries in Electronic Devices Prof. John Robertson, Emeritus Professor of Electronic Engineering at Cambridge University, UK

	Integrated Module Approach to Solutions in the Specialty Device Market Dr. Michael Chudzik, VP of Technology, IMS ICAPS & Packaging Semiconductor Products Group, Applied Materials	50 Years of Silicon Retina History Prof. Tobias Delbruck, Professor in Neuromorphic Engineering, Institute of Neuroinformatics, Switzerland

	MEMS - Sustainable Technologies for a Sustainable World Dr. Giorgio Allegato MEMS Technology R&D Director Analog, MEMS and Sensor Group - STMicroelectronics

Partial List of Confirmed Distinguished CSTIC 2024 Keynote & Invited Speakers

	Enhance Chip Connectivity and Functionality through RRAM-based Monolithic 3D Integration Jianshi Tang, Tsinghua University	A Full Spectrum of Computing-In-Memory Technologies Zhong Sun, Peking University

	All-dielectric metasurfaces for vortex generation and Detection Shumin Xiao, Harbin Institute of Technology	2D devices and in-sensor computing Feng Miao, Nanjing University

	Defect Tolerant Physics-inspired Computing in Memristor Arrays Can Li, University of Hong Kong	Single Element Switch Min Zhu, Shanghai Institute of Microsystem and Information Technology

	High endurance field-effect transistor memory based on Hafnium-oxide ferroelectrics Kechao Tang, Peking University	Implementation of Spintronic MRAM Circuits and Systems Hao Cai, Southeast University

	SRAM based Compute-in-Memory Circuits Design for CNN and Transformers Xin Si, Southeast University	2D Material Devices for Advanced Computing Han Wang, University of Hong Kong

	Recent progress of EUV Chemically Amplified Resist with Negative-Tone Development (CAR-NTD) for improving Chemical Stochastic TORU FUJIMORI, FUJIFILM Corporation	Innovated Methodology Improving CD Uniformity for Lithography Using Wafer-less Dynamic Grouping Process Characteristics Yong-Qiang Che, Semiconductor Manufacturing Beijing Corporation

	The Spin-on Multi-Layer Material Status for Advanced Device Satoshi Dei, JSR Electronic Materials	From Tape to Mirrors: 50 Years of Progress in Photomask Technology Chris Progler, Photronics

	Enhancing High-throughput and High-precision CD-SEM Metrology Through Advanced Deep Learning-Based Image Processing Bo Wang, Hitachi High-Tech Corporation	How Process, Equipment, Material, Computation that work together to make up the Performance of Photolithography Qiang Wu, Fudan University

	Novel Etch Solution with Sym3 for Logic BEOL Patterning Etch Applications Hui Sun, Applied Materials	Plasma and radical etch patterning for 3D structures Jiayang Li, Fudan University

	Challenges of Inductively Coupled Plasma Applications Hu Zhou, AMEC	New development of ICP etching for advanced patterning Zhongwei Jiang, Naura, China

	Plasma etching solutions for compound semiconductors Yali Fu, Naura, China	New Materials and New Functionalities Co-work scaling, and the Exploration of Inner Spacer Technique David Xiao, Qianmo Micros Design LLC

	Review of Advanced Ion Beam Etch Technology: Asymmetrical and Directional Approach Yuxin Yang, Jiangsu Leuven Instruments Co., Ltd.	The challenges and new developments on TSV etch applications Guorong Li, Beijing NAURA Microelectronics Equipment Co., Ltd.

	The Progress and Challenges of Large Scale Integration of Silicon Photonics Jin Guo, CUMEC	The effect of stress on HfO₂-based ferroelectric thin films Feng Luo, Nankai University

	Do we need 300mm GaN? Kai Cheng, Enkris Semiconductor,Inc	Thin Film Atomic Layer Deposition and Selective Processes Rong Chen, Huazhong University of Science and Technology

	Hetero-integration of Gallium Oxide Enabling Bipolar Design and Thermal Management Jiandong Ye, Nanjin University	Tailoring the deposition and composition of advanced oxide and SiCN films to deliver the highest bonding energy for fusion and hybrid bonding applications Zongbin Wang, Applied Materials

	A Chemistry Perspective of ALD Precursors' Properties Xiabing Lou, Suzhou Origin Materials Technology Co,. Ltd	Design Technology Co-Optimization for Yield and Reliability Enhancement of RRAM Technology Platform Zhichao Lv, Reliance Memory

	Si based GaN HEMTs/System R&D and the perspective of the technological commercialization Hongyu Yu, Southen University of Science & Technology	Advances and Reliability Challenges in Heterogeneous Integration in Chiplet Era: from Solder to Copper to Optical Interconnects Zhuo-Jie Wu, HFC semiconductor

	Modeling of Endurance Degradation of Anti-ferroelectric Hf_1-xZr_xO₂ Capacitor Yi Zhao, Zhejiang University	SiGe/Si Heteroepitaxial Epitaxy and Characterization for CMOS and Vertically Stacked DRAM Guilei Wang, Beijing Superstring Academy of Memory Technology

	A Review in III-Nitride Nanocolumns Growth and Applications Enrique Calleja, Universidad Politécnica de Madrid(UPM)	CMP Equipments and Application Technologies for Advanced Manufacturing Process Xinchun Lu, Tsinghua University

	Study on the Processing Characteristics and Polishing Technology of Easily Cleavable Gallium Oxide Crystals Hai Zhou, Yancheng Institute of Technology	Research on the electro-fenton magnetorheological finishing technology for GAN wafer Qiusheng Yan, Guangdong University of Technology

	From Good to Great: The Power of Advanced ILD CMP Slurries in Boosting Performance Juliane Hitzel, Advanced NanoSurface Technologies Co., Ltd.	CMP Technology for More than Moore Innovation Haedo Jeong, Pusan National University

	CMP characteristics of IGZO thin film with a variety of process parameters Ming Zeng, Beijing Superstring Academy of Memory Technology	Mechanism Research and Improvement of AL Scratch Defect Based on MG CMP Qingqing Duan, Shanghai Huali Integrated Circuit Corp.

	New methodology for anisotropic nanoparticles characterization by polarization light scattering: length and diameter determination of rod-like nanoparticles David Jacob, Cordouan Technology	The development progress of new high-efficiency silicon carbide substrate polishing slurry Xiuyan Sun, Founder of Zhangjiagang Anchu Technology Ltd.

	Ceria slurry applications to STI, ILD, and advanced packaging CMP Yuchun Wang, Anji microelectronics	Doping level detection in Si or SiGe via In-Line Raman Spectroscopy Roy Pinhassi, Nova Ltd

	Assessing the Power-Awareness of VLSI Testing Xiaoqing Wen, Kyushu Institute of Technology, Japan	Polymorphic circuits design and applications in security Gang Qu, University of Maryland, USA

	Signal and Power Reliability for Integrated Chips and Chiplets Lei He, UCLA, USA	Jitter reduction for multi-GHz ATE up to 20 GHz Dave Keezer, Eastern Institute for Advanced Study (EIAS), China

	MI's solutions for next era Byoung-Ho Lee, Hitachi High-Tech Corporation	Scaling of Memory Performance and Capacity with Memory Processor Fei Wang, Shandong University

	Study on ELK Dielectric Reliability During the Solder Reflow Process Based on Finite Element Simulations Jialin Zheng, Sanechips Technology Co., Ltd.	Heterogeneous Integration Ecosystem: The Critical Path to the Success of 3D SOC(SOH) Eason Wang, ICLeague

	Study of Defects in Advanced Packing at the Atomistic Scale by Using In Situ TEM Xing Wu, East China Normal University	The Solution and Challenge of Glass Core Substrate Technology Tingyu Lin, Guangdong FoZhiXin (FZX) Microelectronics Technology Research Co. Ltd

	Breaking Memory Wall with SeDRAM® Technology in Chip Level Yue Zhou, Xi'an UniIC Semiconductors Co., Ltd.	Chiplets and Advanced Packaging for Future Computing (Tentative) Terry Wu, Samsung Electronics

	Antimonide semiconductor material for infrared sensing Donghai Wu, Institute of Semiconductors, CAS	Si based GeSn materials and devices Chuanbo Li, Minzu University of China

	A GHz Silicon-based Width Extensional Mode MEMS Resonator with high Q Jinling Yang, Institute of Semiconductors, CAS	XOI materials Xin Ou, Shanghai Institute of Microsystem and Information Technology, CAS

	MEMS Acoustic Device Songsong Zhang, Chengdu Xiansheng Technology/SITRI	Lamb Acoustic Wave Device for RF applications: Ready for Prime Time Challenges and Applications? Songbin Gong, Spectron Tech/UIUC

	NEMS based on novel vdW heterostrucutres Zheng HAN, Shanxi University	Universal Materails and Device Integration Technology for Future Chips Chen Wang, Tsinghua University

	High-mobility 2D P-type semiconductor materials Xiang Chen, Nanjing University of Science & Technology	Atomically sharp interface of van der Waals heterostructures enabled high-performance electronic devices Lihong Bao, Institute of Physics, CAS

	Controllable preparation of wafer-scale two-dimensional van der Waals heterostructures Libo Gao, Nanjing University	Advancing 3D Nano-electronic Systems through Innovations in BEOL-Compatible Oxide Semiconductor Technology Gong Xiao, National University of Singapore (NUS)

	Advanced spectral sensing methods for process monitoring applications Ray Saupe, Fraunhofer ENAS	A Journey of High-Density Associative Memories based on Ferroelectric Content Addressable Memories Xunzhao Yin, Zhejiang University

	Algorithm and Hardware Codesign for Brain-inspired Neuromorphic Computing Aili Wang, Zhejiang University	Ultra-broadband RF Front-end SoC using 0.18um CMOS Technology Jianguo Ma, Zhejiang Lab

	Logic Synthesis based on Semi-tensor Product of Matrices Zhufei Chu, Ningbo University	Efficient and Robust Hardware for Neural Networks Li Zhang, Technical University of Darmstadt

	Optimizing Architecture and Algorithm for Privacy-Preserving Jongeun Lee, Ulsan National Institute of Science and Technology (UNIST)	Navigating Aging Effects: Concepts and Implementation in Reliable Computing Systems Yu-Guang Chen, National Central University

	Photonic-Electronic Design Automation Jiang Xu, Hongkong University of Science and Technology	Ultra Low Power Connectivity SoC for IoT Peter Gammel, UBILITE

	Machine Learning for Device Modeling (MLDM) in the DTCO Eco-system Lining Zhang, Peking University	Diffusive/Quantum Carrier Transport and Multiphysics Simulation Methods of Advanced Electronic/Optoelectronic Devices Wenchao Chen, Zhejiang University

	Design Technology Co-Optimization Methods for Advanced Logic Nodes Xingsheng Wang, Huazhong University of Science and Technology	Exploring AI-in-the-Loop For Physical Design Verification DFM/DTCO EDA Yongfu Li, Shanghai Jiao Tong University

	Scale-out Chiplet-based Systems: Architecture, Design and Pathfinding Puneet Gupta, University of California at Los Angeles	Logic Locking over TFHE for Securing User Data and Algorithms Masanori Hashimoto, Kyoto University

	In-memory Computing and Dynamic Vision Sensors: Recipes for tinyML in Internet of Video Things Arindam Basu, Hongkong City University	Neuromorphic Audio Edge Intelligence Shih-Chii Liu, University of Zurich and ETH Zurich

	Vector Matrix Multiplication with Two-Dimensional Materials Mario Lanza, KAUST	AI Empowers Semiconductor Yield Signoff Ecosystem - Reducing Cost and Increasing Efficiency for Manufacturing with a Diversified Supply Chain Mark Lu, Semitronix Corporation

	Deep Neural Network Proxy Modelling for IC Virtual Fabrication Dong Ni, Zhejiang University	Heterogeneous integration of analog and digital computing-in-memory technologies Shaodi Wang, WITMEM Co. Ltd

	Depth-first convolution-neural-network pipeline for compute-in-memory architecture Cimang Lu, Flash Billion	Nonvolatile emerging memory devices for energy-efficient edge AI Daniele Ielmini, Politecnico Di Milano

	Progress of AI for EDA Algorithms Yu Han, Empyrean Technology Co., Ltd.	Novel Data Storage Technology for AI Xiangshui Miao, Huazhong University of Science and Technology

	The Application of Virtual Manufacturing in IC Process Development Yunlong Li, Zhejiang ICsprout Semiconductor Co., Ltd.	Large Scale VLSI Mask Optimization Bei Yu, The Chinese University of Hong Kong

	The Integration of AI Large Model & Neuromorphic Computing in Memory with High Speed Analog ICs Hongjie Liu, Shenzhen Reexen Technology Co., Ltd.	Research on the application of artificial intelligence in device compact model and technology – circuits co-optimization Ye Lu, Fudan University

	Developing a Neuromorphic Computer: Practices and Challenges Gang Pan, Zhejiang University	Snapdragon Platform for High Performance 5G Mobile SOC & AI/Computing Application Manufactured with 4nm EUV Fin-FET Technology and Beyond Jun Yuan, Qualcomm