Symposium VI: Metrology, Reliability and Testing

Symposium VI: Metrology, Reliability and Testing

Symposium Committee

Dr. Xiaowei Li Chair	ICT, CAS, China
Dr. Peilin SONG Co-Chair	IBM, USA
Dr. Frank Feng Member	Synopsys, USA
Dr. Yiping Xu Member	Raintree Technologies Corp, China
Dr. Yuhua CHENG Member	Peking University, China
Dr. Francis JEN Member	KLA Tencor, China
Dr. Kelvin XIA Member	Huatek, China
Dr. Srinivas RAGHVENDRA Member	Synopsys, USA
Dr. Yu Huang Member	Mentor Graphics, USA
Dr. Jian-fu Zhang Member	Liverpool John Moores University
Dr. Houken Tseng Member	Teradyne, Taiwan, China
Dr. Yu Zhu Member	TSMC, Taiwan, China
Dr. Tung-Yang Chen Member	AIP Technology Corporation, Taiwan, China
Dr. Jianuo Shi Member	KLA Corporation

Symposium VI: Metrology, Reliability and Testing

•   Metrology
   Applications to ICs, thin film heads, systems-on-a-chip, and thin film
   Device manufacturing
   Breakthroughs and advancements in electron/Ion microscopy calibration and accuracy
   Critical dimension metrologies
   Defect detection, analysis, and control
   Limits of metrology and inspection systems
   Mask related metrology
   Measurement system modeling and simulation
   Metrology and inspection methodologies
   Overlay, registration, and alignment metrologies
   Process control, characterization, and yield enhancement

•   Reliability
   3D IC reliability
   Back-End Reliability
   Front-End Reliability
   Memory
   MEMS reliability
   Middle of Line Reliability
   Nano-electronic device reliability
   Package/assembly reliability
   Product reliability and burn-in
   Reliability in designs and circuits
   Reliability in device and process
   Reliability in interconnects
   Reliability qualification strategies

•   Test
   2.5D, 3D and SiP Test
   Analog/Mixed-Signal/RF Test
   ATE hardware and software
   ATPG, test synthesis
   Design-for-Test: chip, board, system
   Design and test for reliability
   Diagnostics
   Failure analysis