Symposium VI: Metrology, Defect Inspection, Reliability and Testing
Symposium Committee
Symposium VI: Metrology, Defect Inspection, Reliability and Testing
• Metrology
Applications to ICs, thin film heads, systems-on-a-chip, and thin film
Device manufacturing
Breakthroughs and advancements in electron/Ion microscopy calibration and accuracy
Critical dimension metrologies
Defect detection, analysis, and control
Limits of metrology and inspection systems
Mask related metrology
Measurement system modeling and simulation
Metrology and inspection methodologies
Overlay, registration, and alignment metrologies
Process control, characterization, and yield enhancement
• Reliability
3D IC reliability
Back-End Reliability
Front-End Reliability
Memory
MEMS reliability
Middle of Line Reliability
Nano-electronic device reliability
Package/assembly reliability
Product reliability and burn-in
Reliability in designs and circuits
Reliability in device and process
Reliability in interconnects
Reliability qualification strategies
• Test
2.5D, 3D and SiP Test
Analog/Mixed-Signal/RF Test
ATE hardware and software
ATPG, test synthesis
Design-for-Test: chip, board, system
Design and test for reliability
Diagnostics
Failure analysis
• Defect Inspection
Defect Analysis & Diagnosis
Silicon Debug & Field Monitoring
Yield Analysis & Optimization
Defect-Based Test and Defect Tolerance
Post-silicon Validation and Debug
AI algorithms for defect detection and classification
Spectroscopic imaging and Raman Spectroscopy
Mass spectrometry imaging and Infrared Thermography
Electrical characterization and analysis
Electron Beam Techniques and Optical Microscopy
Symposium Committee
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Dr. Xiaowei Li Chair |
ICT, CAS, China |
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Prof. David Keezer Co-Chair |
Eastern Institute of Technology, Ningbo |
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Dr. Frank Feng Member |
Synopsys, USA |
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Dr. Yiping Xu Member |
Raintree Technologies Corp, China |
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Dr. Yuhua CHENG Member |
Peking University, China |
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Dr. Francis JEN Member |
KLA Tencor, China |
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Dr. Kelvin XIA Member |
Huatek, China |
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Dr. Srinivas RAGHVENDRA Member |
Synopsys, USA |
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Dr. Yu Huang Member |
Mentor Graphics, USA |
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Dr. Jian-fu Zhang Member |
Liverpool John Moores University |
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Dr. Houken Tseng Member |
Teradyne, Taiwan, China |
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Dr. Yu Zhu Member |
TSMC, Taiwan, China |
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Dr. Tung-Yang Chen Member |
AIP Technology Corporation, Taiwan, China |
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Dr. Jianuo Shi Member |
KLA Corporation |
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Dr. Zhuo-Jie Wu Member |
GHS semiconductor |
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Symposium VI: Metrology, Defect Inspection, Reliability and Testing
• Metrology
Applications to ICs, thin film heads, systems-on-a-chip, and thin film
Device manufacturing
Breakthroughs and advancements in electron/Ion microscopy calibration and accuracy
Critical dimension metrologies
Defect detection, analysis, and control
Limits of metrology and inspection systems
Mask related metrology
Measurement system modeling and simulation
Metrology and inspection methodologies
Overlay, registration, and alignment metrologies
Process control, characterization, and yield enhancement
• Reliability
3D IC reliability
Back-End Reliability
Front-End Reliability
Memory
MEMS reliability
Middle of Line Reliability
Nano-electronic device reliability
Package/assembly reliability
Product reliability and burn-in
Reliability in designs and circuits
Reliability in device and process
Reliability in interconnects
Reliability qualification strategies
• Test
2.5D, 3D and SiP Test
Analog/Mixed-Signal/RF Test
ATE hardware and software
ATPG, test synthesis
Design-for-Test: chip, board, system
Design and test for reliability
Diagnostics
Failure analysis
• Defect Inspection
Defect Analysis & Diagnosis
Silicon Debug & Field Monitoring
Yield Analysis & Optimization
Defect-Based Test and Defect Tolerance
Post-silicon Validation and Debug
AI algorithms for defect detection and classification
Spectroscopic imaging and Raman Spectroscopy
Mass spectrometry imaging and Infrared Thermography
Electrical characterization and analysis
Electron Beam Techniques and Optical Microscopy