Build China's IC Ecosystem
Build China's IC Ecosystem - Advanced Manufacturing，Assembly & Test
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Date:
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Wednesday, March 15, 2017
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Venue:
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Pudong Ballroom 1+2+3, Kerry Hotel Pudong, Shanghai
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Catalyzed by the market outlook, policy and the national fund, heat on Semiconductor industry continuously accumulate. There are more than 12inch Fabs planed for the next 5 years, OSAT is expending accordingly. It is easy to build factory but difficult to make it strong and profitable. How the China Semiconductor manufacturing industry is going to enhance the core competency? How to prioritize resource, re-visit the business model, and cooperate together within the ecosystem?
Attendee Registration Previous Review
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Agenda:
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Build China's IC Ecosystem - Advanced Manufacturing，Assembly & Test
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Moderator:
Dr. Yifan Guo
Vice President, ASE
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9:00-9:05
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Welcome speech
Richard Salsman
CFO and Vice President Operations, SEMI
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9:05-9:30
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Innovative 3D-SiP Package Technologies for More than Moore Era.
Albert Lan
Senior Director, RD & Engineering Center, SPIL
PPT Download
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9:30-9:55
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Keynote Speech: 互利共赢 深化中国IC产业布局
Haibo Lei
President, HLMC
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9:55-10:20
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Domestic CPU accelerates the internationalization process of China IC industry
Frank Fu
VP, 兆芯
PPT Download
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10:20-10:45
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Heterogenous Integration and miniaturization for IC package solutions
Dr. Jim Li
Sr. Director, Central Engineering Integration, ASE
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10:45-11:10
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Assembly Development for Advanced SIP Module
Yupeng Xu
VP of Engineering, ICPU of JCET
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11:10-11:35
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Strengthening China’s IC Ecosystem with Core Competitiveness
Sunny Hui
Senior Vice President of Marketing, SMIC
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11:35-12:00
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Advance Package
Fan Chun Ho
Vice president, ASM
PPT Download
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Build China's IC Ecosystem - Equipment and Material
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Moderator:
Michael Young
GM, APAC Sales, Marketing & Service, AE
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13:00-13:30
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Maximizing fab profitability through lifecycle services
Mike McDonald
Vice President, Global Service, AE
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13:30-14:00
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Keynote Speech: 高端装备国产化，小集成铸就大时代
Jinrong Zhao
President, NAURA
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14:00-14:30
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The back-end market analysis and TEL’s activity
Mr. Kawauchi Takuo
Region Strategy Division, TEL
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14:30-15:00
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Advanced Packaging Technology & Applications
Thomas Bondur
Corporate Vice President, Advanced Packaging, MEMS and IoT Business Group, Lam Research
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15:00-15:20
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Break
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15:20-15:50
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The Memory Evolution: 2D to 3D and Beyond
Er-Xuan Ping
Managing Director, Office of the Chief Technology Officer, Applied Materials, Inc.
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15:50-16:20
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Enable IC breakthroughs with MKS Instruments surrounding chambers
Wei Shao
General Manager, MKS Instruments (Shanghai) Ltd.
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16:20-16:50
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Build cost advantage by right capital equipment purchasing strategy
Jonathan Shang
General Manager, SurplusGLOBAL China, Inc., SurplusGLOBAL
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