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Professor, Vice Dean in the School of Integrated Circuit Science and Engineering, East China Normal University (ECNU). Her research focuses on reliability, especially in situ die- and package-level characterization. She has published 226 SCI and EI papers (as of October 2023) with an H-index of 43, including Science, Nat. Nano., Nat. Commun., IEEE EDL, IEEE TED, IEDM, and VLSI. She has obtained 71 patents granted by China. She received awards such as International Microelectronics Engineering Young Scholars in 2022. She is an IEEE senior member and youth editor of InfoMat, Materials Today Electronics.
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