Symposium VII: Packaging and Assembly

Symposium Committee

Dr. Steve X. Liang
Chair
   
Prof. Xing Wu
Co-Chair 		East China Normal University
   
Dr. Yifan Guo
Co-Chair 		Yibu Semiconductor
   
Dr. Huili Fu
Co-Chair 		HiSilicon
   
Dr. Mark Huang
Member 		Shenzhen University, China
   
Prof. Mingliang Huang
Member 		Dalian University of Technology, China
   
Prof. Kuan-Neng Chen
Member 		National Chiao Tung University
   
Dr. Shin-Puu Jeng
Member 		Director, TSMC
   
Prof. Wenhui Zhu
Member 		Central South University
   
Mr. John Rowland
Member 		Spreadtrum


   
Dr. John Yuanlin Xie
Member 		Altera Corp., CA, USA
   
Dr. Roy Yu
Member 		IBM, Watson Research Center, USA
   
Dr. Yishao Lai
Member 		ASE, Taiwan, China
   
Dr. Jing Shi
Member 		Oracle, USA
   
Dr. Young Do Kweon
Member 		Samsung, Korea
   
Dr. Renzhe Zhao
Member 		Huawei, China
   
Dr. Hong SHI
Member 		Xilinx
   
Dr. Tim Bao
Member 		Air Products and Chemicals, Inc.
   
Dr. Tim Chen
Member 		Yantai Darbond Technology Co., Ltd.
   
Dr. Daniel Lu
Member 		Henkel
   
Dr. Wang Su
Member 		Sinyang Semiconductor
   
Prof. Horng-Show (Frank) Koo
Member 		University into Taipei University of Marine Technology (TUMT)


Dr. Daquan Yu
Member 		Xiamen Sky Semiconductor Co., Ltd.
   
Dr. Minghai Wang
Member 		CTO of Bonotec Electronic Materials
   

Symposium VII: Packaging and Assembly

•  FC/MCP/die stacking/package stacking
•  Embedded active/passive integration
•  MEMS and sensor packaging technology
•  RF and microwave packaging technology
•  LED and photovoltaic packaging technology
•  Emerging technology/Nanotechnology
•  Future packaging materials
•  Interconnect
•  Thermal mechanical/electrical/thermal modeling
•  HDI/high performance interposer design and manufacturing
•  Supply chain management