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Chinese
2019年3月20-22日
上海新国际博览中心

CSTIC 2019 Agenda


Plenary Session

Date: Monday-Tuesday, March 18-19, 2019
Venue: Shanghai International Convention Center 上海国际会议中心
  No.2727 Riverside Avenue Pudong, Shanghai 200120, China 中国上海浦东滨江大道2727号


Distinguished Conference Keynote Speakers


Dr. Simon M. Sze Dr. Yaoguo (Gary) Ding Dr. Min Cao Dr. Evangelos Eleftheriou
Honorary Chair Professor
NCTU

Vice President, Technology and Manufacturing Group
Intel
Vice President, Path-finding
TSMC
Fellow, Neuromorphic Computing
IBM


Monday, March 18, 2019
Meeting Room: 3rd Floor Auditorium
08:45-12:00 Opening Ceremony and Conference Plenary Session
   
  The Floating-Gate Memory—From Concept to Flash Memory to Digital Age
  Dr. Simon M. Sze
  Honorary Chair Professor, NCTU
   
  TBD
  Dr. Yaoguo (Gary) Ding
  Vice President, Intel
   
  Semiconductor Innovation and Scaling: A Foundry Perspective
  Dr. Min Cao
  Vice of President, Path-finding, TSMC
   
  "In-memory Computing": Accelerating AI Applications
  Dr. Evangelos Eleftheriou
  Fellow, Neuromorphic Computing, IBM


Panel Discussion

Technologies for AI Chips: Challenges and Opportunities
17:00-18:30, Monday, March 18, 2019
Meeting Room: 3rd Floor Yellow River Hall


Parallel Symposium Oral Sessions

Monday, March 18, 2019
13:30-17:00 Parallel Symposium Oral Sessions
   
Coffee Break Conference Poster Session
   
Tuesday, March 19, 2019
8:30-18:00 Parallel Symposium Oral Sessions


Training Courses
Workforce Development Advanced Memory Technologies: 3D NAND, DRAM and 3D X-Point
   
Workforce Development Package: Advanced Wafer Level Package, System in Package (SIP) and Testing


Joint Sessions

Symposium II and III-Lithography/Etch joint session
Monday, March 18, 2019
Meeting Room: 3rd Floor Yellow River Hall
Session Chairs: Kafai Lai (IBM) and Ying Zhang (Applied Materials)

Symposium II,VII and IX- Lithography/Emerging/Design Joint session
Tuesday, March 19, 2018
Meeting Room: 3rd Floor Yellow River Hall
Session Chairs: Kafai Lai (IBM), Qinghuang Lin (ASML) and Wenjian Yu(Tsinghua University)

   


Parallel Symposium Oral Sessions

Symposium I: Device Engineering and Memory Technology

Symposium II: Lithography and Patterning

Symposium III: Dry & Wet Etch and Cleaning

Symposium IV: Thin Film, Plating and Process Integration

Symposium V: CMP and Post-Polish Cleaning

Symposium VI: Metrology, Reliability and Testing

Symposium VII: Packaging and Assembly

Symposium VIII: MEMS, Sensors and Emerging Semiconductor Technologies

Symposium IX: Design and Automation of Circuits and Systems



Conference Banquet

Monday, March 18, 2019
Banquet fee

800RMB/Person
Online Registration link;
(http://semi.expotec.com.cn/Visitor/Conference.aspx?lang=en&uid=)

18:30-20:30 Conference Banquet, 上海小南国国会店(http://www.xnggroup.com)
上海市浦东新区滨江大道2727号7楼