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Chinese
2020年6月27-29日
上海新国际博览中心

CSTIC Agenda

Subject to Change



Plenary Session

Date: Sunday-Monday, March 15-16, 2020
Venue: Shanghai International Convention Center 上海国际会议中心
  No.2727 Riverside Avenue Pudong, Shanghai 200120, China 中国上海浦东滨江大道2727号


Distinguished Conference Keynote Speakers
       




Dr. Doug Yu
Vice President, R&D
TSMC
Dr. Ravi Mahajan
Fellow
Intel

Dr. Anthony Yen
Vice President
ASML

Dr. Sanjay Natarajan
Vice President
Applied Materials



Sunday, March 15, 2020
Meeting Room: 3rd Floor Auditorium
08:45-09:30 Opening Ceremony
   
09:30-10:10 Next Big Frontiers - Chiplet Integration and More
  Dr. Doug Yu
  Vice President, R&D, TSMC
   
10:10–10:50 Opportunities in Advanced Packaging for Heterogeneous Integration
  Dr. Ravi Mahajan
  Fellow, Intel
   
10:50–11:25 EUV Lithography - the Road to High-Volume Manufacturing
  Dr. Anthony Yen
  Vice President, ASML
   
11:25–12:00 Integrated Materials Solutions: A Path Forward For Moore's Law
  Dr. Sanjay Natarajan
  Vice President, Applied Materials


Parallel Symposium Oral Sessions
 
Sunday, March 15, 2020
13:30-17:00 Parallel Symposium Oral Sessions
Coffee Break Conference Poster Session
   
Monday, March 16, 2020
8:30-18:00 Parallel Symposium Oral Sessions



Joint Sessions

13:30-15:20, Sunday, March 15, 2020
Symposium II and III-Lithography/Etch joint session
 
8:30-10:20, Monday, March 16, 2020
Symposium II and Symposium IX-DTCO joint session
 
10:00-12:00, Monday, March 16, 2020
Symposium VII and Symposium VIII-3D Heterogeneous Integration joint session


Panel Discussion
 
17:00-18:30, Sunday, March 15, 2020
Meeting Room: 5th Floor Yangtze River Hall
System Integration through 3D and Advanced Packaging


Training Courses
 
Monday, March 16, 2020
Meeting Room: 5F   Meeting Room: 5H
  Workforce Development     Workforce Development
10:00-11:30 Advanced Memory Technologies: MRAM   10:00-11:30 Semiconductor Testing Solutions in the Trend of 5G and AI
13:30-15:00 Advanced Memory Technologies: RRAM   13:30-15:00 Heterogeneous Integration and Advanced Packaging
15:20-16:50 Advanced Memory Technologies: ePCM/3D-PCM   15:20-16:50 IC Reliability Tests for 5G Applications



Parallel Symposium Oral Sessions

Symposium I: Device Engineering and Memory Technology

Symposium II: Lithography and Patterning

Symposium III: Dry & Wet Etch and Cleaning

Symposium IV: Thin Film, Plating and Process Integration

Symposium V: CMP and Post-Polish Cleaning

Symposium VI: Metrology, Reliability and Testing

Symposium VII: Packaging and Assembly

Symposium VIII: MEMS, Sensors and Emerging Semiconductor Technologies

Symposium IX: Design and Automation of Circuits and Systems



Conference Banquet

Sunday, March 15, 2020
Banquet fee

1000RMB/Person
Online Registration link;
(http://semi.expotec.com.cn/Visitor/Conference.aspx?lang=en&uid=)

18:30-21:00 Huangpu River Cruise Banquet, 黄浦江邮轮晚宴


Hotel Floor Layout