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2019年3月20-22日
上海新国际博览中心

合作共赢,做大做强中国集成电路产业链

合作共赢,做大做强中国集成电路产业链

日期: 2018年3月15日 星期四
地点: 上海浦东嘉里大酒店,浦东厅1+2+3
地址: 上海市浦东新区花木路1388号

在线登记  上届回顾

在市场、纲要和基金的推动下,集成电路产业热度不断发酵,今后的五年里中国将会新建多座12寸晶圆厂,中道后道封测行业亦步亦趋。做大易而做强难,中国的集成电路制造产业要如何加强核心竞争力?从技术、市场、商业模式等方方面面,如何励精图治,锐意创新,通力合作?

工欲善其事,必先利其器!做大做强中国的集成电路产业链,装备和材料是基础。纵观我们半导体装备和材料的自给能力,我们还在非常低的水平。了解市场趋势,技术挑战,让国内外厂商一起推进合作共赢, 我们定能众志成城,不断发展壮大!

SPONSORS

 
         
         
         
日程:  
   
Win-Win: Build China's IC Ecosystem - Advanced Packaging
   
Moderator:
Dr. Steve X.Liang
SVP, JCET
   
09:00-09:05
Welcome speech
Richard Gottscho
Executive Vice President & Corporate Chief Technology Officer, Lam Research
Member of the U.S. National Academy of Engineering
   
09:05-09:30
AI Packaging Applications and Solutions!
王愉博
Director, CRD Center, SPIL
   
09:30-09:55
高效能計算的2.5D IC 封裝解決方案
李长祺
日月光集团研发中心,处长
   
09:55-10:20
Advanced Wafer Level Packaging for mmWave Automotive Devices
Seung Wook Yoon Ph.D
Director / Products & Technology Marketing, STATS ChipPAC Pte Ltd.
   
10:20-10:30
Overview of semiconductor materials market trends and technology developments
Michael Corbett
Managing Partner, Linx Consulting
   
10:30-10:55
Innovative Materials Enabling Innovative Processes for Advance Semiconductor Manufacturing
Guanyang Lin, Ph.D
Global Head of R&D and Technical Services, Merck
   
10:55-11:20
Advanced Cleaning Technology for Sub-10nm Semiconductor Manufacturing Process
Dr. Sherman Hsu
资深技术院士, Clean Technology, Avantor
   
11:20-11:30 Lucky Draw, Sponsored by SPIL(Apple Watch&Ipad mini)
观众抽奖,由矽品科技特别赞助 (Apple Watch&Ipad mini)
   
Win-Win: Build China's IC Ecosystem - Advanced Technology
   
Moderator:
Steven Liu
Sr. Vice president of Marketing, UMC-USA
   
13:30-13:55
RF Delivery System Technology at the Leading-Edge
Kevin Fairbairn
General Manager of RF products, Advanced Energy
   
13:55-14:20
主题演讲
打造中国高端集成电路装备的大国重器
Jinrong Zhao
President, NAURA
   
14:20-14:45
Addressing IoT Applications by Leveraging 300 mm Technology Solutions to Enable New Process Capabilities at 200mm
Dr. David Haynes
Senior Director, CSBG Strategic Marketing, Lam research
   
14:45-15:10
桥接未来—中国集成电路行业的风险与机会
杨展悌
Head of Marketing, HLMC
   
15:10-15:35 Break
   
15:35-16:00
协同创新 提升产业链竞争力
李智
中芯国际,执行副总裁,法务/公关/总务
   
16:00-16:25
Integrating domestic and international electronic material solutions
Anshul Sarda
VP, Electronic Special Gases, Linde Group

PPT下载
   
16:25-16:50
万机仪器和你协同合作共同成功
Josh Ding
Chief Technology Office for Flow Solutions, MKS Instruments, Inc.
   
16:50-17:00 Lucky Draw, Sponsored by NISSIN ION (IphoneX)
观众抽奖,由日新意旺特别赞助 (IphoneX)

PPT下载
   
Agenda is subject to change 议程变化恕不另行通知