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Dr. Shin-Puu Jeng Director, TSMC
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Dr. Shin-Puu Jeng is a Director of the Backend Technology
Service Division
in TSMC, focusing on advanced
packaging technology. He was the recipient of the
second National Industrial Innovation Award from the Ministry of Economic Affairs, the Outstanding Engineer Award from the
Chinese Institute
of Engineers, as well as the
Prolific Inventor Award and Best Disclosure Award
from TSMC.
He has served as General Chair of IEEE's Internation
Interconnect
Technology Conference (IITC) as well as Executive Co-Chair of the International Microsystems, Packaging,
Assembly and Circuits Technology Conference
(IMPACT).
He received his Ph.D from the University of Florida and
conducted his
postdoctoral studies at Yale
University.
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