|
TSV Pavilion |
|
TSV Pavilion will supply a platform to display key equipment in current TSV technology, TVS packaging materials and relevant technical service from the perspective of electronic system application and market demand.
Brief Analysis on TSV Market
To comply with the eternal theme that electronic products are developing to meet the market demand of “lighter, thinner, shorter and smaller”, TSV will gradually become a key technology for future IC industry.
Before 2013, the output value of TSV will account for 5-6% of the semiconductor device market with nearly USD 14 – 17 billion; memory industry is an important field in TSV technology application and it is estimated that TSV will take up about USD 4 – 5 billion of total memory output. (Stromberg Data)
The development of TSV technology will bring a huge opportunity for three sectors: semiconductor equipment, materials and service. In terms of equipment, the scale of market value is expected to reach USD 12 billion with materials and services end respectively USD 625 million and USD 2.2 billion. (Stromberg Data)
To comply with the eternal theme that electronic products are developing to meet the market demand of “lighter, thinner, shorter and smaller”, TSV will gradually become a key technology for future IC industry.
Before 2013, the output value of TSV will account for 5-6% of the semiconductor device market with nearly USD 14 – 17 billion; memory industry is an important field in TSV technology application and it is estimated that TSV will take up about USD 4 – 5 billion of total memory output. (Stromberg Data)
The development of TSV technology will bring a huge opportunity for three sectors: semiconductor equipment, materials and service. In terms of equipment, the scale of market value is expected to reach USD 12 billion with materials and services end respectively USD 625 million and USD 2.2 billion. (Stromberg Data)
 |
 |
 |
|
 |
 |
 |
|
| Show All Forum Sessions | |||