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   TSV 生产解决方案培训
 

日期:

2014年3月17日 周一

时间:

13:30~17:00

地点:

上海国际会议中心 3H+3I+3J

价格:

2014年3月1号之前        RMB 1200

 

2014年3月1号之后        RMB 1500


参会注册: Email to stacy.zhang@semi.org.cn

 Instructor:   

  Sesh Ramaswami 
  Ganming Zhao 
  Loke Yuen Wong
 

Lecture Outlines

• Market review and Applied Materials competencies in advanced packaging
• Integration learnings for interposer, via middle, via reveal and via last
• Pillar and RDL electrochemical deposition technologies
• TSV etch technology
• CVD liner and low temp CVD technology
• PVD barrier/seed for TSV and UBM
• TSV copper fill
• CMP applications in TSV
• Q&A


Speaker Bio:
Sesh Ramaswami: With nearly 30 years of semiconductor industry experience, Sesh is currently the managing director of Through-Silicon Via (TSV) and Advanced Packaging program in Advanced Product Technology Development for the Silicon Systems Group at Applied Materials. His responsibilities include market/industry engagement, technology roadmap, strategic customer and external collaborations and co-leading internal process integration programs. He earned his Bachelor in Technology from Indian Institute of Technology (Kanpur, India) and M.S. in Chemical engineering from Syracuse University and MBA from San Jose State University.

Ganming Zhao: Dr. Ganming Zhao is the Sr. technology director at Applied Materials China, responsible for all SSG (semiconductor system group) product technology and development. Dr. Zhao has over 20 years of semiconductor industrial experience in various process technology, flash memory device, advanced logic device, TSV and MEMS technologies. Prior to joining Applied Materials China, Dr. Zhao holds a various technical management positions at Lam Research, AMD and Applied Materials. Dr. Zhao holds a PhD in electrical engineering from University of Missouri-Columbia and MS/BS degree in Microelectronics from Fudan University.

Loke Yuen Wong: Dr. Loke Yuen Wong (黄禄源) is the Global Product Manager for Dielectric Systems and Modules in Applied Materials based in Singapore. His portfolio includes Advanced Packaging-related CVD products. Prior to this role, he was responsible for TSV and Wafer Level Packaging Process Integration at the Applied Materials’ Asia Product Development Center. Loke Yuen received his PhD in Physics from National University of Singapore. He has co-authored numerous journal articles, book chapters and holds several US patents.





Contact us:

JY Zhang SEMI China
Tel: 86-21-60278556
Fax: 86-21-60278511
Email:
jyzhang@semi.org

Stacy Zhang SEMI China
Tel: 86-21-6027855
2
Fax: 86-21-60278511
Email:
stacy.zhang@semi.org.cn
 

 

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