首页   :    同期研讨会/活动 :    回顾SEMICON China 2012 :    中国IC设计制造本土化之路研讨会

The China Market: IC From Design to Manufacturing

Date:Wednesday, March 22, 2012
Time: 08:30 – 17:30
Venue:Kerry Hotel Pudong, Shanghai(Shangri-La Group), Function Room 4
Note:Chinese and English Simultaneous Interpretation will be provided on-site.
 

Sponsored by:   

Program Brief
Represented by ASMC, CSMC, SMIC, Hua Hong NEC and Grace, China local IC industry has been growing and expanding rapidly. In recent years, the gap between China and the rest of the world narrows significantly in terms of technology and design capacity. Volume production has been achieved at 90nm, 65nm, 45nm, and even 32nm process nodes. Meanwhile, IC design occupies nearly 20% market share of the whole industry. Local design and manufacturing supplement each other well and play a key role in the development of China IC Market.

Localization is certainly an irreversible trend, and China local IC industry is set to become a strong power in the future. As an industry association serving the whole supply chain for the microelectronic, display and photovoltaic industries, SEMI China will organize “The China Market: IC Design to Manufacturing” forum in conjunction with SEMICON China 2012.

Prestigious scholars and industry experts will discuss and address on China local IC industry status and future development. This forum provides a great platform for engineers, researchers and other industry peers to discuss advanced engineering and scientific information, ideas and solutions in the industry. It offers a good opportunity to reach customers from the china local IC industry. 

Topics
Advanced technology in IC design and manufacturing
Future IC development trend and challenges
Current IC Manufacture Technology for Telecom
IC design in 4G system
● 4G System Architecture
State-of-the-Art of EDA Tools
 

Who Should Attend
Executives, Experts, engineers, researchers, scholars related to auto-motive electronics design, manufacturing and service

Agenda: 
  
Modrator:
Ningling Wang
Partner, Finnegan, Henderson, Farabow, Garrett & Dunner, LLP
  
8:30 - 9:00Registration
  
9:00 - 9:10Opening Remark

Jonathan Davis
Executive VP, SEMI G.lobal HeadQuarters
  
9:10 - 9:40
Process Technologies for Mobile Computing Devices

Peter Chen, Ph.D.
Senior Director, China Business Development, TSMC
  
9:40 - 10:10
Foundry Solution for Smart Communication
智能半导体之解决方案


Tony Chen
President of Asia Pacific & Japan, Grace Semiconductor
  
10:10 - 10:40
Moore’s law of CMOS scaling and System-on-Chip Technology

Peng Bai
Vice President of the Technology and Manufacturing Group and director of the Derivative Logic Technology Development at Intel Corporation
  
10:40 - 11:10
Smart and Efficient Way to Connect the World
智能互联,绿色无限


GAO, Feng
Vice President, Sales & Marketing, Shanghai Hua Hong NEC Electronics Company, Limited
  
11:10 - 11:40
The New Era for Smart Products---SMIC Technology and Service Platforms智能产品新世代- 中芯国际技术服务平台的构筑

Haijun Zhao  
Vice President, North Operations, SMIC
  

11:40 - 12:10

IC Packaging & Test: The crucial link in the semiconductor supply chain

William T. Chen
ASE Fellow and Senior Technical Advisor, ASE Group

  
13:00 - 13:30
Green Evolution of Mobile Communications Technology

Dr. Chih-Lin I
CMCC Chief Scientist, Wireless Technologies Green Communication Research Center
  
13:30 - 14:00RF Frond End Challenges for 3G and 4G Wireless Terminals

Jim Bao
Director of Engineering, RFMD, Inc.
  
14:00 - 14:30

Eco-system in Nano-era for Design to Manufacturing

Eric Zhu
Spreadtrum
  
14:30 - 15:00

Shrink or Stack: How Design Tools Enable Both to Drive Continued IC Growth

Michael Buehler-Garcia
Director of Marketing for Calibre Design SolutionsMentor Graphics Corporation

  
15:00 - 15:30
Sandeep Bharathi
Vice President of Engineering, Xilinx, Inc.
  
15:30 - 16:00
Tim Ding(丁天洋)
VP from Link-a-media Device

联系我们

吴凯
SEMI China
电话:+86.21.5027.0909*208
传真:+86.21.5027.4830
邮箱:kwu@semi.org


 

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