SEMICON China - 同期研讨会/活动 - 回顾SEMICON China 2012 - 中国IC设计制造本土化之路研讨会

首页 : 同期研讨会/活动 : 回顾SEMICON China 2012 : 中国IC设计制造本土化之路研讨会

The China Market: IC From Design to Manufacturing

Date:	Wednesday, March 22, 2012
Time:	08:30 – 17:30
Venue:	Kerry Hotel Pudong, Shanghai(Shangri-La Group), Function Room 4
Note:	Chinese and English Simultaneous Interpretation will be provided on-site.

Sponsored by:

Program Brief
Represented by ASMC, CSMC, SMIC, Hua Hong NEC and Grace, China local IC industry has been growing and expanding rapidly. In recent years, the gap between China and the rest of the world narrows significantly in terms of technology and design capacity. Volume production has been achieved at 90nm, 65nm, 45nm, and even 32nm process nodes. Meanwhile, IC design occupies nearly 20% market share of the whole industry. Local design and manufacturing supplement each other well and play a key role in the development of China IC Market.

Localization is certainly an irreversible trend, and China local IC industry is set to become a strong power in the future. As an industry association serving the whole supply chain for the microelectronic, display and photovoltaic industries, SEMI China will organize “The China Market: IC Design to Manufacturing” forum in conjunction with SEMICON China 2012.

Prestigious scholars and industry experts will discuss and address on China local IC industry status and future development. This forum provides a great platform for engineers, researchers and other industry peers to discuss advanced engineering and scientific information, ideas and solutions in the industry. It offers a good opportunity to reach customers from the china local IC industry.

Topics

● Advanced technology in IC design and manufacturing

● Future IC development trend and challenges

● Current IC Manufacture Technology for Telecom

● IC design in 4G system

● 4G System Architecture

● State-of-the-Art of EDA Tools

Who Should Attend
Executives, Experts, engineers, researchers, scholars related to auto-motive electronics design, manufacturing and service

Agenda:

Modrator:	Ningling Wang Partner, Finnegan, Henderson, Farabow, Garrett & Dunner, LLP

8:30 - 9:00	Registration

9:00 - 9:10	Opening Remark Jonathan Davis Executive VP, SEMI G.lobal HeadQuarters

9:10 - 9:40	Process Technologies for Mobile Computing Devices Peter Chen, Ph.D. Senior Director, China Business Development, TSMC

9:40 - 10:10	Foundry Solution for Smart Communication 智能半导体之解决方案 Tony Chen President of Asia Pacific & Japan, Grace Semiconductor

10:10 - 10:40	Moore’s law of CMOS scaling and System-on-Chip Technology Peng Bai Vice President of the Technology and Manufacturing Group and director of the Derivative Logic Technology Development at Intel Corporation

10:40 - 11:10	Smart and Efficient Way to Connect the World 智能互联，绿色无限 GAO, Feng Vice President, Sales & Marketing, Shanghai Hua Hong NEC Electronics Company, Limited

11:10 - 11:40	The New Era for Smart Products---SMIC Technology and Service Platforms智能产品新世代- 中芯国际技术服务平台的构筑 Haijun Zhao Vice President, North Operations, SMIC

11:40 - 12:10	IC Packaging & Test: The crucial link in the semiconductor supply chain William T. Chen ASE Fellow and Senior Technical Advisor, ASE Group

13:00 - 13:30	Green Evolution of Mobile Communications Technology Dr. Chih-Lin I CMCC Chief Scientist, Wireless Technologies Green Communication Research Center

13:30 - 14:00	RF Frond End Challenges for 3G and 4G Wireless Terminals Jim Bao Director of Engineering, RFMD, Inc.

14:00 - 14:30	Eco-system in Nano-era for Design to Manufacturing Eric Zhu Spreadtrum

14:30 - 15:00	Shrink or Stack: How Design Tools Enable Both to Drive Continued IC Growth Michael Buehler-Garcia Director of Marketing for Calibre Design SolutionsMentor Graphics Corporation

15:00 - 15:30	Sandeep Bharathi Vice President of Engineering, Xilinx, Inc.

15:30 - 16:00	Tim Ding（丁天洋） VP from Link-a-media Device

联系我们

吴凯
SEMI China
电话：	+86.21.5027.0909*208
传真：	+86.21.5027.4830
邮箱：	kwu@semi.org