3DIC Technology Forum
| Date: | Wednesday, March 21, 2012 |  |
| Time: | 08:30 – 17:30 | |
| Venue: | Kerry Hotel Pudong, Shanghai(Shangri-La Group), Pudong Ballroom 4 | |
| Note: | Chinese and English Simultaneous Interpretation will be provided on-site. | |
| Topics | |
| - | 3DIC市场分析 |
| - | 3DIC系统集成 |
| - | 3DIC封装测试 |
| - | 3DIC芯片制造 |
| - | EDA工具的发展状况 |
| - | 3DIC标准发展状况 |
| Who Should Attend | |
| Executives, Experts, engineers, researchers, scholars related to auto-motive electronics design, manufacturing and service | |
| Agenda | |
| Conference Host: Eileen Yan | |
 | Assistant Technical Director of MEMS&TSV Department, SMIC |
| 8:30 – 9:00 | Registration |
9:00-9:10 | Opening Remark Dr. Allen Lu President, SEMI China |
9:10-9:55 | Embracing the Era of 2.5D & 3D ICs Dr. Ho-Ming Tong Chief R&D Officer & General Manager of Group R&D, ASE Group |
9:55-10:25 | Ye Tian Chun Director, Institute of Microelectronics, Chinese Academy of Sciences |
10:25-10:55 | TSV market trends: Evolution of the market drivers and development of the supply chain infrastructure Pscal Viaud (費歐德) CTO, Yole Développement, Taiwan |
10:55-11:25 | Three-Dimensional Integration – A Systems’ perspective to Orthogonal Scaling |
11:25-11:55 | Lung Chu Corp VP and President of China Operations, Global Unichip Corp |
13:00- 13:30 | SMIC's perspectives, current activities and high-level plan on 2.5/3D IC Dr. ShiuhWuu Lee, TD Leader, SMIC |
13:30 – 14:00 | 中国企业在3D封装时代的机遇与挑战 Wang Xin Chao |
14:00 – 14:30 | 2.5-D ICs: Just a Stepping Stone of a Long Term Alternative to 3-D? |
14:30: 15:00 | The Emerging Challenges of 3d IC Test Gregory Smith General Manager, Computing & Communications Business Unit, Teradyne |
15:00 – 15:30 | The Demanding and the Challenges of TSV Technology Application in IC & System Fu HuiLi Director, Assembly & Testing, Hua Wei |
15:30 – 16:00 | The Implementation of 3D IC Designs with Through-Silicon Vias CZ Chen, AE Director (PhD), Cadence Design Systems, Inc. |
16:00 – 16:30 | Hidenori Sato Senior Manager, TEL |
16:30 – 17:00 | Progresss of 3DICS Standards James Amano Senior Director, SEMI |
联系我们
| 吴凯 | |
| SEMI China | |
| 电话： | +86.21.5027.0909*208 |
| 传真： | +86.21.5027.4830 |
| 邮箱： | kwu@semi.org |
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