首页   :    同期研讨会/活动 :    回顾SEMICON China 2012 :    3D IC及其关键技术研讨会

3DIC Technology Forum

Date:Wednesday, March 21, 2012
Time: 08:30 – 17:30
Venue:Kerry Hotel Pudong, Shanghai(Shangri-La Group), Pudong Ballroom 4
Note:Chinese and English Simultaneous Interpretation will be provided on-site.
 

会议简介
当今市场,电子产品正在朝着短小轻薄的方向发展。为了满足这些需求,我们需要缩小芯片的尺寸,但是到了纳米工艺阶段,这样的做法受到了摩尔定律的限制。在摩尔定律达到极限之后,我们还能做些什么?SEMI中国将举办3DIC技术研讨会对3DIC集成技术进行探讨。

Topics
 - 3DIC市场分析
 - 3DIC系统集成
 - 3DIC封装测试
 - 3DIC芯片制造
 - EDA工具的发展状况
 - 3DIC标准发展状况
  
Who Should Attend
Executives, Experts, engineers, researchers, scholars related to auto-motive electronics design, manufacturing and service

Agenda 
  
Conference Host: Eileen Yan
     Assistant Technical Director of MEMS&TSV Department, SMIC
  
8:30 – 9:00Registration
  
9:00-9:10
Opening Remark

Dr. Allen Lu
President, SEMI China
  
9:10-9:55
Embracing the Era of 2.5D & 3D ICs

Dr. Ho-Ming Tong
Chief R&D Officer & General Manager of Group R&D, ASE Group
  
9:55-10:25
Ye Tian Chun
Director, Institute of Microelectronics, Chinese Academy of Sciences
  
10:25-10:55

TSV market trends: Evolution of the market drivers and development of the supply chain infrastructure

Pscal Viaud (費歐德)
CTO, Yole Développement, Taiwan
  

10:55-11:25

Three-Dimensional Integration – A Systems’ perspective to Orthogonal Scaling

Subramanian S. Iyer
IBM Fellow and Chief Technologist at the Microelectronics Division, IBM Systems & Technology Group

  
11:25-11:55
Lung Chu
Corp VP and President of China Operations, Global Unichip Corp
  

13:00- 13:30

SMIC's perspectives, current activities and high-level plan on 2.5/3D IC

Dr. ShiuhWuu Lee, TD Leader, SMIC
  

13:30 – 14:00

中国企业在3D封装时代的机遇与挑战

Wang Xin Chao
President, Jiang Yin Chang Dian
王新潮,江苏长电科技股份有限公司董事长

  
14:00 – 14:30

2.5-D ICs: Just a Stepping Stone of a Long Term Alternative to 3-D?

Sandeep Bharathi
Vice President of Engineering, Xilinx, Inc.


  
14:30: 15:00
The Emerging Challenges of 3d IC Test

Gregory Smith
General Manager, Computing & Communications Business Unit, Teradyne
  
15:00 – 15:30
The Demanding and the Challenges of TSV Technology Application in IC & System

Fu HuiLi
Director, Assembly & Testing, Hua Wei
  
15:30 – 16:00
The Implementation of 3D IC Designs with Through-Silicon Vias

CZ Chen, AE Director (PhD), Cadence Design Systems, Inc.
  
16:00 – 16:30
Hidenori Sato
Senior Manager, TEL
  

16:30 – 17:00

 

Progresss of 3DICS Standards

James Amano
Senior Director, SEMI
 


联系我们

吴凯
SEMI  China
电话:+86.21.5027.0909*208
传真:+86.21.5027.4830
邮箱:kwu@semi.org


 


 

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