Dr. John H. Lau
John H. Lau has been an ITRI Fellow of Industrial Technology Research Institute (ITRI in Taiwan) since January 2010. Prior to that, he was a visiting professor at HKUST (Hong Kong University Science & Technology) for 1 year, the Director of Microsystems, Modules & Components (MMC) Laboratory with Institute of Microelectronics (IME in Singapore) for 2 years and a Senior Scientist/MTS at HP/Agilent in California, US for more than 25 years.
With more than 35 years of R&D and manufacturing experience, he has authored or co-authored more than 350 peer-reviewed technical publications, more than 20 issued and pending patents and more than 100 book chapters, and given more than 260 lectures/workshops/keynotes worldwide. He has authored and co-authored 16 textbooks on 3D MEMS packaging, reliability of 2D and 3D IC interconnects, advanced packaging, flip chip & WLP, high-density PCB, SMT, and lead-free materials, soldering, manufacturing and reliability.
John earned his PhD degree in theoretical and applied mechanics from the University of Illinois at Urbana Champaign, an MASc degree in structural engineering from the University of British Columbia, a second MS degree in engineering mechanics from the University of Wisconsin at Madison and a third MS degree in management science from Fairleigh Dickinson University. John also has a BE in civil engineering from National Taiwan University. He is an elected ASME Fellow and has been an IEEE Fellow since 1994.