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Dr. Ying ZHANG
VP, Applied Materials, USA

Ying Zhang is currently the manager of the Reactive Ion Etching group in IBM T.J. Watson Research Center. He received his Ph.D. in physics at the SUNY Albany. From 1990 to 1993, he worked on plasma-surface interactions and processing at IBM T. J. Watson Research Center. From 1993 to 1996, he was with Tegal Corp. working on developing high density plasma processing tools and etching processes. Since 1996, he has been with IBM T. J. Watson Research Center working on plasma processing for advanced microelectronics, including many generations of CMOS device fabrications and nanometer scale device structures beyond CMOS era.

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