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李基铭 博士 日月光中坜厂 客户工程整合处资深处长 |
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个人简介 李基铭博士目前担任日月光中坜厂客户工程整合处资深处长，负责新产品导入。李博士在封装技术研发拥有超过17年的经验，期间也在设计、模拟与度量实验室、商业拓展与技术支持等单位担任管理职务，拥有超过十多项封装技术相关专利。李基铭博士毕业于美国西北大学取得化学工程博士学位。 摘要 Heterogeneous integration and miniaturization becomes a focused subject as this is a critical solution for tomorrow’s package. By heterogeneous integration and miniaturization, we are able to assemble several types of components into a given size/area package such that a device can be equipped with multiple functions. This solution may extend and go beyond the spirit of Moors’ law. With the growth of IoT, sophisticated algorithm for cloud computing and big data, current electronic devices are becoming smarter and yet device size is even much smaller than the predecessors. Today's devices not only process data/ information passively; also actively sense environment (mechanically, optically, and chemically), analyze data, generate information and take actions. In this presentation, we update package miniaturization solutions and shares progresses to integrate heterogeneous components in a package to meet requirement for advanced devices, and pave the path for tomorrow's needs. |
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