Dr. Chia-Hong Jan
Chia-Hong Jan is an Intel Senior Fellow and the director of high-performance computing and system-on-chip (SoC) technology integration for the Technology and Manufacturing Group at Intel Corporation. He is responsible for Intel’s most advanced process technology development for next-generation CPUs used in high-performance and SoC product segments, including data center, cloud server, desktop, laptop, notebook, tablet, smartphone, application-specific integrated circuits, field-programmable gate arrays and wireless communication products.
Since joining Intel in 1991, Jan has held a number of technical and management positions in Portland Technology Development for 0.8um, 0.55µm, 0.35µm, 0.25µm, 0.18µm, 0.13µm, 90nm, 65nm, 45nm, 32nm and now 22nm advanced CMOS technology development. He was the rapid thermal processing (RTP) and advanced silicon deposition (ASD) group leader, working on the development of novel salicide technology, advanced gate oxide processes, source/drain junction engineering and epi SiGe technology for strained silicon. He led the team that spearheaded the integration of new salicide materials, including titanium (0.55µm), cobalt (0.18µm) and nickel into the basic logic CMOS process. He was the 90nm interconnect integration manager, and his team was the first in the industry to successfully integrate low-k ILD materials for high performance microprocessors. He was also the program manager for the 65nm low-power chipset process technology and 45nm SoC process technology for Intel® Atom™ processor –based low-power products, which were the first in industry to deploy the innovative high-k/metal gate technology on SoC.
Jan holds 37 U.S. patents in the fields of semiconductor manufacturing process and integration. He has published more than 40 technical papers related to CMOS processing technology. Jan has received three Intel Achievement Awards and is the recipient of the 2008 Distinguished Achievement Award of the College of Engineering at the University of Wisconsin-Madison.
Jan received his bachelor's degree in chemical engineering from National Taiwan University in 1982. He also earned his MBA from National Taiwan University in 1986. He then earned his master's degree and Ph.D. in materials science from the University of Wisconsin-Madison in 1988 and 1991, respectively.