 | Dr. John H. Lau ITRI Fellow, Industrial Technology Research Institute, Taiwan |
Dr. John Lau has been an ITRI Fellow of Industrial Technology Research Institute (ITRI in Taiwan) since January 2010. Prior to that, he was a visiting professor at HKUST for 1 year, the Director of MMC Laboratory with IME in Singapore for 2 years and a Senior Scientist/MTS at HPL/Agilent in California, US for more than 25 years. With more than 35 years of R&D and manufacturing experience, he has published more than 350 peer-reviewed papers, 30 issued and pending US patents, given 270 lectures/workshops/keynotes worldwide, published 16 textbooks on 3D MEMS packaging, 2D and 3D IC integrations, flip chip & WLP, high-density PCB, SMT, and lead-free materials, soldering, manufacturing and reliability. John earned his PhD degree from the University of Illinois, 3 MASc degrees in North America. John received many awards, e.g., the best IEEE/ECTC Proceedings paper (1989) award, best ASME Transactions paper (Journal of Electronic Packaging, 2000) award, best IEEE Transactions paper (in CPMT, 2010) award, ASME/EEP Outstanding Technical Achievements award, IEEE/CPMT Manufacturing award, Outstanding Contribution award, and Outstanding Sustained Technical Contribution award. SME Total Excellence in Electronics Manufacturing award, and IEEE Meritorious Achievement in Continuing Education award. He is an elected ASME Fellow and has been an IEEE Fellow since 1994. | |
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