Keynote & Invited Speakers

Plenary Session

Dr. Leo Esaki, Nobel Laureate, IBM Fellow, Chairman of the Science and Technology Promotion Foundation of Ibaraki, Japan 

Dr. Kinam Kim, Samsung Fellow, President and CEO of Samsung Institute of Advanced Technology, Korea 

Dr. Luc Van den hove, CEO of IMEC, Belgium  

Symposium I: Design and Device Engineering

Keynote Speakers

Chung H. Lam, Distinguished Engineer, IBM, USA

Doris Bruce, IBM, USA

Simon Deleonibus, Director, CEA Research, France

Huili (Grace) Xing, Professor, University of Notre Dame, USA

Invited Speakers

Huiming Bu, IBM, USA

Frederick T. Chen, Deputy R&D Director, ITRI, Taiwan

Jianfu Zhang, Professor, Liverpool John Moores University, UK

Rama Divakaruni, Distinguished Engineer & Chief Technologist for Low Power, IBM, USA

Chee-wee Liu, Professor, National Taiwan University, Taiwan China

Hongyu Yu, Nanyang University of Technology, China

Symposium II: Lithography and Patterning

Keynote Speakers

Vivek Singh, Fellow, Intel Corporation, USA

Ralph Dammel, Fellow, AZ Chemical, USA

Ken Wu, Manager, SMIC, China

Banqiu Wu, CTO, AMAT, USA

Ying Zhang, IBM, USA

Vahid Vahedi, VP, Etch Products, Lam Research Corporation, USA

Invited Speakers

Donis Flagello, NRCA Fellow, Nikon Research Corporation of America, USA

Li Jia, Ph.D. Candidate, The University of Hong Kong, Hong Kong  China

Qiang Shu, Senior Engineer, Semiconductor Manufacturing International Corp., China

Andreas Erdmann, Head of Lithography Simulation, Fraunhofer IISB, Germany

Yalin Xiong, VP of Engineering, KLA-Tencor, Canada

Jinyu Zhang, Associate Professor, Institute of Microelectronics, Tsinghua University, China

Yuri Granik, Chief Engineering Scientist, Mentor Graphics, USA

George Barclay, Director, Dow Chemical, USA

Peter Cheang, Marketing Director, ASML, Taiwan  China

Linyong Pang, Sr. VP & GM, Luminescent Technologies, Inc., USA
 
Motokatsu Imai, Manager, Nikon Corporation, Japan

Soichi Inoue, Program Manager, Toshiba, Japan

Benjamin Lin, Lithography Application Director, Cymer Southeast Asia Ltd., Taiwan  China

Symposium III: Dry &Wet Etch and Cleaning

Keynote Speakers

Vahid Vahedi, VP,  Etch Products,  Lam Research Corporation, USA

Dennis W. Hess, Thomas C. DeLoach, Jr. Professor of Chemical & Biomolecular Engineering, Georgia Institute of Technology, USA

Ying Zhang, IBM, USA

Banqiu Wu, CTO, AMAT, USA

Invited Speakers

Erwine Pargon, Researcher, CNRS-LTM, France

Meihua Shen, Sr. Director, Applied Materials, USA

Maxime Darnon, Researcher, CNRS-LTM, France

Takayuki Toshima, Process Technology Senior Director Development HQ, Tokyo Electron Kyushu LTD, Japan

Mukund Srinivasan, VP and GM, Clean Products, Lam Research Corporation, USA

Lee Chen, Principal Engineer, Tokyo Electron America (TEA), USA

Symposium IV: Thin Film Technology

Keynote Speakers

Qikun Xue, Professor/Member of CAS, Dean and Academian, Tsinghua University, China

Chia-Hong Jan, Director, Fellow, Intel, USA

Mikael Östling, Professor, Dean of school of information technilogy of KTH, IEEE fellow, Fellow of Royal Institute, Sweden

Tadahiro Ohmi, Professor, Tohoku University, Japan

Andrew Kummel, Professor, University of California, USA

Invited Speakers

Tony Chiang, Chief Technology Officer, Intermolecular, Inc., USA

Eric M. Vogel, Professor, Georgia Institute of Technology, USA

Zhang Beichao, Assistant Director, Semiconductor Manufacturing International (Shanghai) Corporation, China

Ding Peijun, VP, North Electronic, China

Fu Haiying, Director, Novellus, USA

Er-Xuan Ping, Managing director,  Applied Materials, USA

Gouri Sankar Kar, Principal Integration Engineer, Imec, Belgium

Symposium V: CMP and Post-CMP Cleaning

Keynote Speakers

Ken Cadien, Professor, Canada Research Chair, University of Alberta, Canada

Invited Speakers

Ananth Naman, VP, R&D, Cabot Microelectronics Corporation, USA

Cuong Tran, Segment Manager, ATMI, USA

David Huang, Pall Corp., USA

Jin Lu, Micron, USA           

Edwin Tseng, Application Technical Manager, Nexplanar, USA         

Jin-Goo Park, Professor, Hanyang University, Korea

Ching-Hsun Chao, Senior Scientist, DOW, Taiwan China

Laertis Economikos, Senior Technical Staff Member, IBM, USA

Sidney Huey, Dir., CMP Global Product Marketing, Applied Materials CMP Division, USA

Symposium VI: Materials and Process Integration for Device and Interconnection

Keynote Speakers

Qikun Xue, Professor/Member of CAS, Dean and Academian, Tsinghua University, China

Chia-Hong Jan, Director, Intel, USA

Paul A. Kohl, Professor, Georgia Institute of Technology, USA

Shili Zhang, Professor, Uppsala University, Sweden

Johan Liu, Professor, Chalmers University of Technology, Sweden

Bich-Yen Nguyen, Senior Fellow/Manager, Soitec, USA

Mikael Östling, Professor, Dean of school of information technilogy of KTH, IEEE fellow, Fellow of Royal Institute of Technology,Sweden

Invited Speakers

Leonard Rubin, Scientist, Axcelis Technologies, USA

Edward Yi Chang, Professor, National Chiao Tung University, Taiwan China

Huicai Zhong, Professor, Institute of Microelectronics, Chinese Academy of Sciences, China

Larry Zhao, Research Manager, IMEC,  Belgium

Richard (Dick) James, Senior Technology Analyst, Chipworks, Canada

Xiao Sun, Senior Researcher, IMEC,  Belgium

Symposium VII: Packaging and Assembly

Keynote Speakers

Takayuki Ohba, Professor, University of Tokyo, Japan

John Lau, Fellow, ITRI, Taiwan China

Paul Enquist, Director, Ziptronicx, USA

Robert Patti, CTO, Tezzaron Semiconductor Corp, USA

Invited Speakers

Paul D Franzon, Professor, NC State University, USA

Ganesh Subbarayan, Professor, Purdue University, USA

Yogendra Joshi, Chair Professor, Georgia Institute of Technology, USA

Eren Kursun, RSM,  IBM, USA

Roy Yu, Sr. Egnineer, IBM, USA

Kuan-Neng Chen, Professor, National Chiao Tung University,  Taiwan China

Daniel Tracy, Senior Director, SEMI, USA

Symposium VIII:  Metrology, Reliability and Testing

Keynote Speakers

R. D. (Shawn) Blanton, Professor, Carnegie Mellon University, USA

David G. Seiler, Division Chief, National Institute of Standards and Technology, USA

Asen Asenov, Prof. of EE,University of Glasgow, UK

Invited Speakers

Qiang Xu, Prof. of CSE, The Chinese University of Hong Kong, China

Yu Huang, Sr. Research Staff, Mentor Graphics Co., USA

Guido Groeseneken, Prof. of Dept. of ESAT, Katholieke Univ. Leuven - IMEC, Belgium

Yoshiyasu Ito, Researcher, Rigaku Corporation, Japan

Xinli Gu, Senoir Director, DFX technology, Huawei Technologies , USA

Symposium IX: Emerging Semiconductor Technologies

Keynote Speakers

Barbara De Salvo, Head of the Advanced Memory Group, CEA-LETI, France

Thomas N. Theis, Program Mangager, New Devices and Architectgures for Computing, IBM, USA

Invited Speakers 
 
Joerg Schulze, Professor, Universität Stuttgart , Germany

Cheol Seong Hwang, Professor, Department of Materials Science and Engineering and Inter-university Semiconductor Research, Seoul National University, South Korea

Jin-Seong Park, Professor, Dankook University, South Korea

Hsiang-Lan Lung, Manager, Integration & Exploration Group Leader, Macronix International Co. Ltd., USA

Koukou Suu, General Manager, ULVAC, Inc, Japan

Debdeep Jena, Professor, Univeristy of Notre Dame, USA

Tom Thieme, Business Development Manager, LayTec AG, Germany

Daniele Ielmini, Professor, Politecnico di Milano, Italy

Keon Jae Lee, Professor, Korea Advanced Institute of Science and Technology (KAIST), Korea

Huili (Grace) Xing, Professor, Univeristy of Notre Dame, USA

Tomi T. Li, Professor, National Central University, Taiwan China

Symposium X:Advances In MEMS and Sensor Technologies

Keynote Speakers

Benedetto Vigna, Group Vice President of Analog, Power, MEMS Group, ST Microelectronics, Italy

Xaiowei Shen, Associate Director, IBM Research, China/USA 

Liwei Lin, Chancellor's Professor of the Department of Mechanical Engineering, UC Berkeley, USA 

Hans Zappe, Prefossor, Department of Microsystems Engineering, University of Freiburg, Germany 

Invited Speakers

Herb Huang, Director, SMIC, China

Liesbet Lagae, Research groupleader of IMEC and associate proferssor of Catholic University Leuven, 
IMEC and Catholic University Leuven, Belgium 

Xinxin Li, Professor, Shanghai Institute of Microsystems, China

Zewen Liu, Professor, Institute of Microelectronic, Tsinghua University, Beijing 

Miao Lu, Professor, Xiamen University, China 

Jean Philippe Polizzi, Microsystems Program Manager, CEA-LETI, France 

Horst Theuss, Principal, Infineon Technologies, Germany 

M. Juergen Wolf, Head of Division HDIWLP/ASSID, Fraunhofer IZM, Germany 

Haixia Zhang, Professor, Peking University, China

Zhiyong Li, Principle Investigator, HP Labs, USA

Gregory N. Nielson, Principal Member of Technical Staff, Sandia National Laboratories, USA

Zheyao Wang, Professor, Tsinghua University, China