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Symposium VI: Metrology, Reliability and Testing 

Symposium Committee

Dr. Peilin SONG
Chairman

IBM, USA

Dr. Baozhen Li
Co-Chair

IBM System and Technology Group, US

Dr. Frank Feng
Member

Mentor Graphics Corporation,USA
  Dr. Yiping Xu
  Member
  Raintree Technologies Corp, China

Dr. Yuhua CHENG
Member

Peking University, China

Dr. Francis JEN
Member

KLA Tencor, China

Dr. Kelvin XIA
Member

Verigy, China

Dr. Srinivas RAGHVENDRA
Member

Synopsys

Dr. Xiaowei LI
Member

Chinese Academy of Sciences

Dr. Yu Huang
Member

Mentor Graphics, USA

Dr.Jian-fu Zhang
Member

Liverpool John Moores University

Dr. Houken Tseng
Member

Teradyne, Taiwan

Symposium VI: Metrology, Reliability and Testing

  • Metrology

                 Applications to ICs, thin film heads, systems-on-a-chip, and thin film

                 Device manufacturing

                 Breakthroughs and advancements in electron/Ion microscopy calibration and accuracy

                 Critical dimension metrologies

                 Defect detection, analysis, and control

                 Limits of metrology and inspection systems

                 Mask related metrology

                Measurement system modeling and simulation

                Metrology and inspection methodologies

                Overlay, registration, and alignment metrologies

                 Process control, characterization, and yield enhancement

  • Reliability

                  3D IC reliability

                  Back-End Reliability

                  Front-End Reliability

                  Memory

                  MEMS reliability

                  Middle of Line Reliability

                  Nano-electronic device reliability

                  Package/assembly reliability

                  Product reliability and burn-in

                  Reliability in designs and circuits

                  Reliability in device and process

                  Reliability in interconnects

                  Reliability qualification strategies

  • Test

                   2.5D, 3D and SiP Test

                   Analog/Mixed-Signal/RF Test

                   ATE hardware and software

                   ATPG, test synthesis

                   Design-for-Test: chip, board, system

                   Design and test for reliability

                   Diagnostics

                   Hardware Security

                   IDDQ and current test

                   Memory test

                   Microprocessor Test

                   Power issues in test

                   System-on-Chip test

                   System-in-Package test

                   Test and design for manufacturability

                   Test for nanometer technologies

 

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