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Symposium VIII: Metrology, Reliability and Testing 

Symposium Committee

Dr. Peilin SONG
Chairman

IBM, USA

Dr. Bin WANG
Co-Chair

Yangzhou Daoyuan Microelectronics, China

Dr. Yiping Xu
Co-Chair

Sr.Vice President ahd CTO,Raintree Technologies Corp

Dr. Yuhua CHENG
Member

Peking University, China

Dr. Francis JEN
Member

KLA Tencor, China

Dr. Kelvin XIA
Member

Verigy, China

Dr. Srinivas RAGHVENDRA
Member

Synopsys

Dr. Xiaowei LI
Member

Chinese Academy of Sciences

Dr. Yu Huang
Member

Mentor Graphics, USA

Dr. Baozhen Li
Member

 IBM System and Technology Group, USA

Dr.Jian-fu Zhang
Member

Liverpool John Moores University

Dr. Houken Tseng
Member

Teradyne, Taiwan

Symposium VIII: Metrology, Reliability and Testing

  • Metrology
    -          Applications to ICs, thin film heads, systems-on-a-chip, and thin film device manufacturing
    -          Breakthroughs and advancements in electron/Ion microscopy calibration and accuracy
    -          Critical dimension metrologies
    -          Defect detection, analysis, and control
    -          Limits of metrology and inspection systems
    -          Mask related metrology
    -          Measurement system modeling and simulation
    -          Metrology and inspection methodologies
    -          Overlay, registration, and alignment metrologies
    -          Process control, characterization, and yield enhancement

  • Reliability
    -             MEMS reliability
    -             Nano-electronic device reliability
    -             Package/assembly reliability
    -             Product reliability and burn-in
    -             Reliability in designs and circuits
    -             Reliability in device and process
    -             Reliability in interconnects
    -             Reliability qualification strategies
    -             3D IC reliability

  • Test
    -             ATE hardware and software
    -             ATPG, test synthesis
    -             Chip Security
    -             Design-for-Test: chip, board, system
    -             Design and test for reliability
    -             Diagnostics
    -             IDDQ and current test
    -             Memory test
    -             Microprocessor Test
    -             Mixed-Signal and Analog Test
    -             Power issues in test
    -             System-on-Chip test
    -             System-in-Package test
    -             Test and design for manufacturability
    -             Test for nanometer technologies
    -             3D integrated circuits testing

 

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