首页   :    半导体技术大会 :    论文征集/投稿



Symposium VII: Packaging and Assembly (
CPMT APM Joint Symposium)


Symposium Committee

Dr. Steve Liang
Chairman

Jiangsu Changjiang Electronics Technology Co., Ltd, China

Mr. Yifan Guo
Co-Chair

ASE Shanghai

Mr. Huili Fu
Co-Chair

HiSilicon

Dr. John Yuanlin Xie

Altera Corp., San Jose, CA, USA

Dr. Mark Huang
Member

SuZhou Speed Semiconductor, China

Dr. Wenhui Zhu
Member

Professor,Central South University

Mr.John Rowland
Member

Spreadtrum

Prof. Mingliang Huang
Member

Dalian University of Technology, China

Dr. Roy Yu
Member
IBM, Watson Research Center, USA

Dr. Yishao Lai
Member

ASE. Taiwan, China

Dr. Jing Shi
Member

Senior Hardware Engineer, Oracle, USA

Dr. Young Do Kweon
Member

Samsung, Korea

Dr. Renzhe Zhao
Member

Huawei, China

Dr. Dan Tracy
Member

SEMI, USA

Dr. Hong SHI
Member

Xilinx

Dr. Tim Bao
Member

Air Products and Chemicals

Dr. Tim Chen
Member

Yantai Darbond Technology Co., Ltd.

Dr. Daniel Lu
Member

Henkel

Symposium VII: Packaging and Assembly (CPMT APM Joint Symposium)

  • 3DIC/WLSCP/TSV process and reliability

  • FC/MCP/die stacking/package stacking

  • Embedded active/passive integration

  • MEMS and sensor packaging technology

  • RF and microwave packaging technology

  • LED and photovoltaic packaging technology

  • Emerging technology/Nanotechnology

  • Future packaging materials

  • Interconnect

  • Thermal mechanical/electrical/thermal modeling

  • HDI/high performance interposer design and manufacturing

  • Thermal management/active cooling

  • Supply chain management

 
*Han,Jianglong, HHCK.
Chairman The Challenges and Opportunities of Epoxy Molding Compound
  

*Lily Khor & Lynn Simporios-Guirit,Carsem Semiconductor (Suzhou) Co. Ltd.
 Feasibility Study on MEMS Packaging Low Cost Solutions

 *Lily Khor & Lynn Simporios-Guirit, Dongkai NCAP.
Enabling 3D Packaging Through Collaborative Innovation

 *M.L. Huang, Dalian University of Technology.
Professor Electromigration Reliability of Lead-free Solder Interconnects
 

 

 

沪ICP备06022522号沪公网安备31011502010679号